參數(shù)資料
型號(hào)： FBGA
英文描述： FBGA - FBGA User＇s Guide. Version 4.2
中文描述： FBGA封裝- FBGA封裝用戶指南。版本4.2
文件頁(yè)數(shù)： 94/97頁(yè)
文件大?。?/td> 2624K
代理商： FBGA
FBGA User’s Guide
Version 4.2, November 1, 2002
93
Chapter 3—FBGA Thermal Management
Added “T
ASS
= Temperature of Ambient Air at Steady State” to the “
θ
JA
– Junction to Air” equations
Table 3-2. Thermal Resistance Data:
Changed table headings “
θ
JC
(°C/W)” to “
θ
JMA
(°C/W)” and
“
θ
JMA
(°C/W)” to “
Ψ
J–T
(°C/W). Shifted down the values in the
θ
JMA
(°C/W) table column. Moved
data of the FGC048
Ψ
J–T
(°C/W) table cell to the FGC048
θ
JMA
(°C/W) location. Added the following
table notes: “4.
θ
JMA
=
Theta of junction to moving air.” and “5. SPD (LFPM) = Speed of moving air,
in terms of “Linear Feet Per Minute”.” Corrected the FBD063
θ
JA
(°C/W) data.
Revision H (Version 4.0): January 24, 2002
Chapters 1–4
Chapters were completely rewritten. It is recommended that users of previous editions read through
these chapters to familiarize themselves with the revised content.
Chapter 5
New daisy chain schematics and board layouts have been added. The first two figures from the
previous User’s Guide have been deleted.
Revision I (Version 4.1): April 12, 2002
Chapter 2
Figure 2-3: Added Am29PDS322D to list of devices in 8 x 9 mm package.
Figure 2-7: corrected 4Gb to 128 Mb.
Chapter 5
Corrected figure 5-7 from 80 to 84 ball; figure 5-8 from 64 to 84 ball, figure 5-10 from 80 to 64 ball.
Chapter 6
Table 6.1: Corrected units of measure in thickness column from mm to μm. Deleted E-05 from
specifications in CTE ppm/c column.
Added descriptions for FLA069, FLB073, LAA064, LAA080, LAB 080, and LBA176
Chapter 7
Recommended Board Desin Dimensions: Modified table to show both 0.30 and 0.60 mm balls.
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