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參數(shù)資料
| 型號(hào)： | FBGA |
| 英文描述： | FBGA - FBGA User＇s Guide. Version 4.2 |
| 中文描述： | FBGA封裝- FBGA封裝用戶指南。版本4.2 |
| 文件頁數(shù)： | 15/97頁 |
| 文件大?。?/td> | 2624K |
| 代理商： | FBGA |
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FBGA User’s Guide
14
Version 4.2, November 1, 2002
Chapter 3:
AMD Fortified-BGA
New performance driven applications continues to demand high board level reliability packages from
Flash memories. In addition, as PCB designs become increasingly complex, assembly-friendly
package becomes more desirable. AMD’s Fortified-BGA for the Flash memory combines both
superior reliability beyond the standard requirements and ease-of-use in one single package. It is ideal
for telecom, networking, automotive and avionics applications.
Package Construction
AMD’s Fortified-BGA is offer in a single easy to use 13x11mm x 1.4mm Ht. Package size, with
0.6mm solder ball diameter at 1.0mm ball pitch. Designed around AMD's already robust FBGA
(0.8mm ball pitch), the Fortified-BGA uses industry proven BT-Substrate to lower the CTE mismatch
between the substrate and the PCB.
Figure 3-1. Fortified-BGA Construction
Note: Package Height = 1.4mm Max.
Effects of Solder Ball Diameter
It is well known in the industry that solder ball diameter has a direct affect on solder joint reliability
during temperature cycling. Lager solder balls typically yield higher standoff heights after board
assembly. The importance of higher standoff is easiest explained through CTE mismatch. As describe
in many papers, higher standoff typically yields higher solder joint reliability during temperature
cycling. AMD's Fortified-BGA currently has the largest solder ball size (0.6mm Diameters) of any
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