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參數(shù)資料
| 型號： | FBGA |
| 英文描述： | FBGA - FBGA User＇s Guide. Version 4.2 |
| 中文描述： | FBGA封裝- FBGA封裝用戶指南。版本4.2 |
| 文件頁數(shù)： | 78/97頁 |
| 文件大?。?/td> | 2624K |
| 代理商： | FBGA |
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FBGA User’s Guide
Version 4.2, November 1, 2002
77
MSG
results are also presented in the
white paper referenced earlier.
■
Board Level Rework Ability
and Socket Suppliers
NVD and MSD engineers
teamed up to familiarize board-
level rework companies with the
FBGA package. They also worked
with socket suppliers, for those
customers who do programming
prior to system assembly, to ar-
range support for AMD's FBGA
package.
■
Alternative Supply Sources
NVD Marketing contacted
some of our competitors and
showed them footprints and
pinouts for our flash memory
parts. After negotiating some
pinout changes, NVD got their
commitment to support both the
μ
BGA and the FBGA pack-age
styles for the same flash memo-
ries. NVD also worked with the
industry-wide JEDEC JC-42.4
Committee to establish AMD’s
version of the FBGA pinout as an
official industry standard. Be-
cause of this, all FBGA packaged
flash memories manufactured in
the world today conform to the
AMD footprint. We are continu-
ing to work with JEDEC for the
adoption of additional FBGA
footprints designed to accommo-
date future generations of very
high-density, high-performance
flash memories.
THE FRUITS OF OUR LABORS
This infrastructure work took
about a year to come to fruition
and, because of AMD’s success in
this effort, FBGAs are now the
most preferred CSP package for
flash memories used in com-
mercial and industrial applica-
tions.
μ
BGA shipments still
outnumber FBGAs due to the top
two or three cellular telephone
OEMs using them in large quan-
tities; however, the number of
OEMs now choosing FBGAs for
flash far exceeds those preferring
the
μ
BGA. With AMD able to pro-
duce flash memory roadmaps
knowing what the package foot-
print will look like years in the
future, whether it be burst mode,
page mode, or random access types
of flash memory, even the OEMs
committed to
μ
BGA are now want-
ing FBGAs for future designs.
Thanks go to the following
AMDers for their valuable con-
tributions to this article and for
the instrumental roles they
played in bringing the industry
around to embracing the FBGA:
Bruce Schupp, Melissa Lee,
Ranjit Gannamani, Vis Valluri, and
Sidharth Sidharth.
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