參數(shù)資料
型號: FBGA
英文描述: FBGA - FBGA User's Guide. Version 4.2
中文描述: FBGA封裝- FBGA封裝用戶指南。版本4.2
文件頁數(shù): 22/97頁
文件大?。?/td> 2624K
代理商: FBGA
FBGA User’s Guide
Version 4.2, November 1, 2002
21
Chapter 5:
Daisy Chains
Daisy Chains are primarily requested by OEMs to perform assembly evaluations. Prior to production,
an OEM will generally solder daisy chain samples on to a daisy chain PCB and perform Open/Short
testing to check for misalignments. This test will help OEMs characterize its assembly process and
equipment prior to full production. Daisy Chains are also used in Second Level Solder-Joint Board
Reliability studies. The daisy chain samples are assembled onto the matching PCB and subjected to
temperature cycling in an oven. Board Level Reliability tests are tools to help predict and measure the
expected life of a packages. For more in depth information on Second Level Solder-Joint Board
Reliability, please refer to “Reliability Evaluation Of Chip Scale Packages” by Ranjit Gannamani,
Viswanath Valluri, Sidharth, and MeiLu Zhang (see “Article Reprints”). For more in-depth
information on Daisy Chains please refer to the “Daisy Chain Samples Application Note”. Both are
listed in the Appendices.
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