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參數(shù)資料
| 型號： | FBGA |
| 英文描述： | FBGA - FBGA User＇s Guide. Version 4.2 |
| 中文描述： | FBGA封裝- FBGA封裝用戶指南。版本4.2 |
| 文件頁數(shù)： | 58/97頁 |
| 文件大?。?/td> | 2624K |
| 代理商： | FBGA |
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FBGA User’s Guide
Version 4.2, November 1, 2002
57
Chapter 8:
Component Qualification Testing
AMD has one of the highest reliability standards in the industry. Beginning from wafer sort to shipping
of products, AMD has implemented vary stages of testing to ensure high quality and reliability.
Samples are subjected to accelerated stress tests.
The advantages of accelerated stress testing are that these tests use fewer parts and can make failures
occur faster. The stress levels used for these tests are more severe than that seen in the field with well-
designed tests resulting in the same failure mechanisms. Component level testing includes:
1. Preconditioning (Moisture Level Testing)
2. Temperature Cycling
3. Highly Accelerated Stress Test (HAST)
4. Thermal Shock
5. Data Retention Bake
6. High Temperature Operating Life (HTOL)
7. Latch-up
8. Electrostatic Discharge (ESD)
Preconditioning
The Moisture Level Testing is modeled after JEDEC/IPC Standard J-STD-020A. This test is designed
to determine the safe environmental conditions for product exposure, thus reducing the risk of
moisture induced damages. Moisture damages may include, delamination, package cracks during
reflows of board assembly, and “popcorn” effects.
There are six level of moisture sensitivity (See Table 8.1). Products are tested at Level-1 conditions, if
fail, the next higher level is tested until it passes. The only difference between each level is the
parameter of the moisture soak (also know as preconditioning).
There are 3 basic components:
1. 24 hour dry bake at 125°C
2. Preconditioning: Moisture storage parameters depending on JEDEC Moisture Sensitivity Level at
which the package is being qualified (See Table 8.1).
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