
B-87
FBGA User’s Guide
please refer to “Reliability Evaluation of Chip Scale
Packages” by Ranjit Gannamani, Viswanath Valluri,
Sidharth, and MeiLu Zhang.
Currently AMD has three types of FBGA daisy chains:
Stitched Daisy Chains, Metal Mask Daisy Chains and
Substrate Daisy Chains. Since the main purpose is to
characterize assembly process and equipment, OEMs
typically have no preference on the type of daisy chain
used.
DESCRIPTIONS
Stitched Daisy Chains
The functional substrate is used with a dummy silicon
slug. Daisy chain patterns are produced by shorting
pairs of adjacent bond-fingers on the substrate via wire
bonding. There are no wire bonds from the dummy sil-
icon slug to the substrate.
Metal Mask Daisy Chains
The functional substrate is used with a special daisy
chained wafer. There is no active circuitry on the wafer,
only the simulated bond-pads. Adjacent bond-pads are
shorted via metal mask. Daisy chain patterns are pro-
duced by wire bonding the bond-fingers on the sub-
strate to the bond-pads on the wafer.
Substrate Daisy Chains
A dummy silicon slug is used with a special daisy
chained substrate. Shorting adjacent balls on the sub-
strate produces daisy chain patterns.
9 X 8 MM FINE PITCH-BGA (WC) DAISY CHAIN SCHEMATIC
Note:
a and b are input and output of the network.
12 X 6 MM 48-BALL FINE PITCH-BGA DAISY CHAIN SCHEMATIC
Note:
a and b are input and output of the network.
A
B
C
D
E
F
G
H
6
5
4
3
2
1
A
B
C
D
E
F
G
H
a
b
6
5
4
3
2
1
Package Connection (Bottom View)
Board Connection (Top View)
A
B
C
D
E
F
G
H
1
2
3
4
5
6
Package Connection (Bottom View)
Board Connection (Top View)
A
B
C
D
E
F
G
H
a
b
1
2
3
4
5
6