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參數(shù)資料
| 型號(hào)： | FBGA |
| 英文描述： | FBGA - FBGA User＇s Guide. Version 4.2 |
| 中文描述： | FBGA封裝- FBGA封裝用戶(hù)指南。版本4.2 |
| 文件頁(yè)數(shù)： | 16/97頁(yè) |
| 文件大小： | 2624K |
| 代理商： | FBGA |
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FBGA User’s Guide
Version 4.2, November 1, 2002
15
BGA package for Flash memory. As a result, AMD’s Fortified-BGA offers superior board level
reliability, during Temperature Cycling, compared to other competitor’s BGA packages. When
compared to a competitor’s 10x13mm BGA, the 64-Ball (8x8 matrix) Fortified-BGA is expected to
have a higher relative life by a factor of 4.3X, and the 80-Ball (8x10 matrix) Fortified-BGA is
expected be 4.6X higher relative life.
Fortified-BGA Migration and Transition
AMD’s Fortified-BGA has taken AMD’s tradition of simple pinout migration to higher density one
step further. It virtually allows migration between densities without new board designs.
Fortified-BGA’s 11x13mm package size is designed to host any Flash density up to 256Mb. This
concept greatly lowers cost for customers. By anticipating future density needs, customers can
virtually have one board design. Furthermore, this “one-package-fits-all” concept can also help trim
equipment cost. The same socket, test boards, handlers, traces etc. are now interchangeable between
densities. Thereby increases the useful life of equipments.
AMD's Fortified-BGA takes full advantage of the real estate underneath the package. With 1.0mm ball
pitch, PCB design rules can be more relaxed. At any drill or pad size, 1.0mm pitch provides more
clearance for traces and spaces. For example, either 5mil or 7mil trace and space design rules can by
used. More clearance also allows for larger via capabilities, ideal for multi-layer PCB designs.
Board assembly also benefits from 1.0mm ball pitch. AMD's Fortified-BGA is aligned with many
FPGAs and Micro-Controller in terms of ball pitch. This allows for less expensive PCB technology to
be used.
AMD's Fortified-BGA, in essence, simplifies customers' transition to BGA packages. It is a Low-
Cost, highly reliable CSP solution to TSOP and other traditional leaded packages.
Fortified-BGA (
F
BGA) Pinouts
All pinouts are shown top view, with balls facing down.
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| FBI1.5A4S1 | Bridge Rectifiers (In Line) |
| FBI1.5B4S1 | Bridge Rectifiers (In Line) |
| FBI1.5B5S2 | Bridge Rectifiers (In Line) |
| FBI1.5D4S1 | Bridge Rectifiers (In Line) |
| FBI1.5D5S2 | Bridge Rectifiers (In Line) |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| FBGA96T.5-DC144 | 制造商:未知廠家 制造商全稱(chēng):未知廠家 功能描述:FBGA96T.5-DC144 |
| FBGA-SD | 制造商:STATSCHIP 制造商全稱(chēng):STATSCHIP 功能描述:Fine Pitch Ball Grid Array - Stacked Die |
| FBGC-1.44G | 制造商:MERRIMAC 制造商全稱(chēng):MERRIMAC 功能描述:FILTER |
| FBGC-2.75G | 制造商:MERRIMAC 制造商全稱(chēng):MERRIMAC 功能描述:FILTER |
| FBGC-3-1.4G | 制造商:MERRIMAC 制造商全稱(chēng):MERRIMAC 功能描述:FILTER |
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