參數(shù)資料
型號(hào): EDX5116ABSE-3C-E
廠商: ELPIDA MEMORY INC
元件分類: DRAM
英文描述: 512M bits XDR DRAM (32M words ?16 bits)
中文描述: 32M X 16 RAMBUS, PBGA104
封裝: LEAD FREE, FBGA-104
文件頁(yè)數(shù): 61/78頁(yè)
文件大?。?/td> 3611K
代理商: EDX5116ABSE-3C-E
Preliminary Data Sheet E0643E30 (Ver. 3.0)
61
EDX5116ABSE
Supply Current Profile
In this section, Table 15 summarizes the supply currents (I
DD
and I
TERM,DRSL
) that characterize this memory component.
These parameters are shown under different operating condi-
tions.
Table 15
Supply Current Profile
Symbol
Power State and Steady State Transaction
Rates
Maximum
@t
CYCLE
= 2.000 ns
@ x16/x8/x4 width
Maximum
@t
CYCLE
= 2.500 ns
@ x16/x8/x4 width
Maximum
@t
CYCLE
= 3.333 ns
@ x16/x8/x4 width
Units
I
DD,PDN
Device in PDN, self-refresh enabled.
a
TBD
25/25/25
TBD
mA
I
DD,STBY
Device in STBY. This is for a device in STBY
with no packets on the Channel
a
TBD
270/270/270
TBD
mA
I
DD,ROW
ACT command every t
RR
,
PRE command every t
PP
a
TBD
600/600/600
TBD
mA
I
DD,WR
ACT command every t
RR
,
PRE command every t
PP
,
WR command every t
CC.a
TBD
1200/1000/900
TBD
mA
I
DD,RD
ACT command every t
RR
,
PRE command every t
PP
,
RD command every t
CCa
TBD
1300/1200/1100
TBD
mA
I
TERM,DRSL,WR
WR command every t
CC.b, c
TBD
150/90/60
TBD
mA
I
TERM,DRSL,RD
RD command every t
CC.b
TBD
290/150/90
TBD
mA
a. I
DD
current @ V
DD,MAX
flowing into VDD pins
b. I
TERM,DRSL
current @ V
TERM,DQ,MAX
flowing into VTERM pins
c. Mesurement condition: DQ/DQN input swing level is 300mV.
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EDX5116ACSE-3C-E 制造商:ELPIDA 制造商全稱:Elpida Memory 功能描述:512M bits XDR? DRAM