參數(shù)資料
型號(hào): EDS2532EEBH-9A
廠商: Elpida Memory, Inc.
英文描述: 256M bits SDRAM (8M words x 32 bits)
中文描述: 256M位的SDRAM(800萬字× 32位)
文件頁數(shù): 7/50頁
文件大?。?/td> 718K
代理商: EDS2532EEBH-9A
EDS2532EEBH-9A
Preliminary Data Sheet E0617E40 (Ver. 4.0)
7
AC Characteristics (TA = 0
°
C to +70
°
C, VDD, VDDQ = 1.8V ± 0.1V, VSS, VSSQ = 0V)
-9A
Parameter
Symbol
min.
max.
Unit
Notes
System clock cycle time
(CL = 2)
tCK
9
ns
1
(CL = 3)
tCK
9
ns
1
CLK high pulse width
tCH
3
ns
1, 5
CLK low pulse width
tCL
3
ns
1, 5
Access time from CLK
tAC
7
ns
1, 2, 5, 6
Data-out hold time
tOH
2.5
ns
1, 2, 5, 6
CLK to Data-out low impedance
tLZ
0
ns
1, 2, 3, 5, 6
CLK to Data-out high impedance
tHZ
7
ns
1, 4, 6
Input setup time
tSI
2
ns
1, 5
Input hold time
tHI
1
ns
1, 5
Ref/Active to Ref/Active command period
tRC
68
ns
1
Active to Precharge command period
tRAS
50
120000
ns
1
Active command to column command (same bank)
tRCD
18
ns
1
Precharge to active command period
tRP
18
ns
1
Write recovery or data-in to precharge lead time
tDPL
18
ns
1
Last data into active latency
tDAL
2CLK + 18ns
Active (a) to Active (b) command period
tRRD
18
ns
1
Transition time (rise and fall)
tT
0.5
1.0
ns
Refresh period
(4096 refresh cycles)
Notes: 1. AC measurement assumes tT = 0.5ns. Reference level for timing of input signals is 0.5
×
VDDQ.
2. Access time is measured at 0.5
×
VDDQ. Load condition is CL = 30pF.
3. tLZ (min.) defines the time at which the outputs achieves the low impedance state.
4. tHZ (max.) defines the time at which the outputs achieves the high impedance state.
5. If tT
1ns, each parameters is changed as follows;
tAC, tOH, tLZ: should be added (tT (rise)/2 – 0.5)
tCH, tCL, tSI, tHI: should be added {(tT (rise) + tT (fall))/2 – 1}
6. Driver strength is Half condition.
tREF
64
ms
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