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參數(shù)資料
| 型號(hào)： | CE5038 |
| 廠商： | Intel Corp. |
| 英文描述： | DVB-S2 Advanced Modulation Satellite Tuner |
| 中文描述： | DVB - S2的先進(jìn)調(diào)制衛(wèi)星調(diào)諧器 |
| 文件頁數(shù)： | 35/41頁 |
| 文件大小： | 463K |
| 代理商： | CE5038 |
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CE5038
Data Sheet
34
Intel Corporation
The paddle is designed to be soldered to a size-matched pad on the PCB (see Figure 10) which is thermally
connected to an efficient heat sink. The heat sink can be as simple as an area of copper ground plane on the
underside of the board, thereby reducing the system cost. To transfer the heat from the paddle to the underside of
the board, an array of 25 x 0·3 mm vias are used between the topside pad, which will be soldered to the paddle,
and the ground plane on the underside of the board. It is also possible to use a smaller number of larger vias, e.g.,
16 x 0·5 mm, but this arrangement is marginally less efficient.
The area of copper in the ground plane must be at least 2,000 mm2 for 1 oz copper. If 2 oz copper board is used or
if multiple ground planes are available, as with a four-layer board, the area could be reduced somewhat, but in
general it is better to have the maximum cooling possible, as reliability will always be enhanced if lower
temperatures are maintained.
While it is possible to use a paste mask that simply duplicates the aperture for the 4.15 mm sq. paddle, the quantity
of solder paste under the device can cause problems and it is preferable to reduce the coverage to a level between
50% and 80% of the area. The pattern shown in Figure 11 reduces the coverage to approximately 60%, which
should reduce out-gassing from under the device and improve the stand-off height of the package from the board.
A very useful publication giving further details is: “Application Notes for Surface Mount Assembly of Amkorts
MicroLeadFrame (MLF) Packages” which can be found on: www.amkor.com
5.2 Crystal Oscillator Notes
Figure 14 - Typical Oscillator Arrangement with Optional Output
Figure 15 - Typical Arrangement for External Oscillator
Table 19 - Crystal Capacitor Values for 4 MHz and 10 MHz Operation
(component numbering refers to the example schematic, Figure 2)
Component
4 MHz
10 MHz
C10
47 pF
100 pF
C11
47 pF
100 pF
Note: C12, a 10 pF (15 pF for 10 MHz) capacitor may be added between the crystal and
Gnd if an oscillator output is required. Output is from the crystal/capacitor junction.
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