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參數(shù)資料
| 型號： | BX80525U700256E |
| 廠商： | INTEL CORP |
| 元件分類： | 微控制器/微處理器 |
| 英文描述： | 32-BIT, 700 MHz, MICROPROCESSOR, XMA |
| 文件頁數(shù)： | 94/102頁 |
| 文件大?。?/td> | 878K |
| 代理商： | BX80525U700256E |
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Datasheet
91
Pentium III Processor for the SC242 at 450 MHz to 800 MHz
6.2.2
Boxed Processor Fan Heatsink Weight
The boxed processor fan heatsink will not weigh more than 225 grams. See Section 4.0 and
Section 5.0 for details on the processor weight and heatsink requirements.
6.2.3
Boxed Processor Retention Mechanism
The boxed processor requires processor retention mechanism(s) to secure the processor in the 242-
contact slot connector. S.E.C.C.2 processors must use either retention mechanisms described in
AP-826, Mechanical Assembly and Customer Manufacturing Technology for S.E.P. Packages
(Order Number 243748) or Universal Retention Mechanisms that accept S.E.C.C., S.E.P.P. and
S.E.C.C.2 packaged processors. The boxed processor will not ship with a retention mechanism.
Baseboards designed for use by system integrators must include retention mechanisms that support
the S.E.C.C.2 package and the appropriate installation instructions.
Baseboards designed to accept both Pentium II processors and Pentium III processors have
component height restrictions for passive heatsink support designs, as described in AP-588,
Mechanical and Assembly Technology for S.E.C. Cartridge Processors (Order Number 243333).
Figure 52. Top View Air Space Requirements for the Boxed Processor
Table 38. Boxed Processor Fan Heatsink Spatial Dimensions
Fig. Ref.
Label
Refers to
Figure
Dimensions (Inches)
Min
Typ
Max
A
50
S.E.C.C.2 Fan Heatsink Depth (off processor
substrate)
1.48
B
50
S.E.C.C.2 Fan Heatsink Height Above Baseboard
0.4
C
51
S.E.C.C.2 Fan Heatsink Height
2.2
D
51
S.E.C.C.2 Fan Heatsink Width (plastic shroud only)
4.9
E
51
S.E.C.C.2 Power Cable Connector Location From
Edge of Fan Heatsink Shroud
1.4
1.45
F
52
Airflow keep out zones from end of fan heatsink
0.40
G
52
Airflow keepout zones from face of fan heatsink
0.20
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