參數(shù)資料
型號(hào)： BX80525U700256E
廠(chǎng)商： INTEL CORP
元件分類(lèi)： 微控制器/微處理器
英文描述： 32-BIT, 700 MHz, MICROPROCESSOR, XMA
文件頁(yè)數(shù)： 50/102頁(yè)
文件大小： 878K
代理商： BX80525U700256E
Datasheet
51
Pentium III Processor for the SC242 at 450 MHz to 800 MHz
5.0
S.E.C.C. and S.E.C.C.2 Mechanical Specifications
Intel Pentium III processors use either S.E.C.C. or S.E.C.C.2 package technology. Both package
types contain the processor core, L2 cache, and other passive components. The cartridges connect
to the baseboard through an edge connector. Mechanical specifications for the processor are given
in this section. See Section 1.1.1 for a complete terminology listing.
5.1
S.E.C.C. Mechanical Specifications
S.E.C.C. package drawings and dimension details are provided in Figure 21 through Figure 30.
Figure 21 shows multiple views of the Pentium III processor in an S.E.C.C. package; Figure 22
through Figure 25 show the package dimensions; Figure 26 and Figure 27 show the extended
thermal plate dimensions; and Figure 28 and Figure 29 provide details of the processor substrate
edge finger contacts. Figure 30 and Table 29 contain processor marking information. See
Section 5.2 for S.E.C.C.2 mechanical specifications.
The processor edge connector defined in this document is referred to as the “SC242 connector.”
See the Slot 1 Connector Specification (Order Number 243397) for further details on the SC242
connector.
Note:
For Figure 21 through Figure 43, the following apply:
1. Unless otherwise specified, the following drawings are dimensioned in inches.
2. All dimensions provided with tolerances are guaranteed to be met for all normal production
product.
3. Figures and drawings labeled as “Reference Dimensions” are provided for informational
purposes only. Reference Dimensions are extracted from the mechanical design database and
are nominal dimensions with no tolerance information applied. Reference Dimensions are
NOT checked as part of the processor manufacturing. Unless noted as such, dimensions in
parentheses without tolerances are Reference Dimensions.
4. Drawings are not to scale.
Figure 21. S.E.C.C. Packaged Processor — Multiple Views
Left
Right
Side
Left
Right
Thermal Plate
Side View
Cover Side view
Top View
Left Latch
Right Latch
Cover
Thermal
Plate
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