參數(shù)資料
型號(hào)： BX80525U700256E
廠(chǎng)商： INTEL CORP
元件分類(lèi)： 微控制器/微處理器
英文描述： 32-BIT, 700 MHz, MICROPROCESSOR, XMA
文件頁(yè)數(shù)： 37/102頁(yè)
文件大小： 878K
代理商： BX80525U700256E
Pentium III Processor for the SC242 at 450 MHz to 800 MHz
4
Datasheet
4.0
Thermal Specifications and Design Considerations......................................................... 47
4.1
Thermal Specifications........................................................................................ 48
4.1.1
Thermal Diode........................................................................................ 50
5.0
S.E.C.C. and S.E.C.C.2 Mechanical Specifications......................................................... 51
5.1
S.E.C.C. Mechanical Specifications.................................................................... 51
5.2
S.E.C.C.2 Mechanical Specification.................................................................... 58
5.3
S.E.C.C.2 Structural Mechanical Specification ................................................... 64
5.4
Processor Package Materials Information .......................................................... 66
5.5
Intel
Pentium III Processor Signal Listing........................................................ 66
5.6
Intel
Pentium III Processor Core Pad to Substrate Via Assignments .............. 75
5.6.1
Processor Core Pad Via Assignments (CPUID 067xh).......................... 75
5.6.2
Processor Core Signal Assignments (CPUID 067xh) ............................ 75
5.6.3
Processor Core Pad Via Assignments (CPUID 068xh).......................... 88
6.0
Boxed Processor Specifications....................................................................................... 89
6.1
Introduction ......................................................................................................... 89
6.2
Fan Heatsink Mechanical Specifications............................................................. 89
6.2.1
Boxed Processor Fan Heatsink Dimensions .......................................... 89
6.2.2
Boxed Processor Fan Heatsink Weight.................................................. 91
6.2.3
Boxed Processor Retention Mechanism ................................................ 91
6.3
Fan Heatsink Electrical Requirements ................................................................ 92
6.3.1
Fan Heatsink Power Supply ................................................................... 92
6.4
Fan Heatsink Thermal Specifications.................................................................. 93
6.4.1
Boxed Processor Cooling Requirements ............................................... 93
7.0
Intel Pentium III Processor Signal Description ............................................................. 94
7.1
Alphabetical Signals Reference .......................................................................... 94
7.2
Signal Summaries ............................................................................................. 101
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