參數(shù)資料
型號(hào)： BX80525U700256E
廠商： INTEL CORP
元件分類： 微控制器/微處理器
英文描述： 32-BIT, 700 MHz, MICROPROCESSOR, XMA
文件頁數(shù)： 91/102頁
文件大?。?/td> 878K
代理商： BX80525U700256E
Datasheet
89
Pentium III Processor for the SC242 at 450 MHz to 800 MHz
6.0
Boxed Processor Specifications
6.1
Introduction
The Pentium III processor is also offered as an Intel boxed processor. Intel boxed processors are
intended for system integrators who build systems from baseboards and components. Boxed
Pentium III processors are supplied with an attached fan heatsink. This section documents
baseboard and system requirements for the fan heatsink that will be supplied with the boxed
Pentium III processor. This section is particularly important for original equipment manufacturer’s
(OEM's) that manufacture baseboards for system integrators. Unless otherwise noted, all figures in
this section are dimensioned in inches. Figure 49 shows a mechanical representation of a boxed
Pentium III processor in the S.E.C.C.2 package. Boxed Pentium III processors are not available in
the S.E.C.C. package.
Note:
The airflow of the fan heatsink is into the center and out of the sides of the fan heatsink.
6.2
Fan Heatsink Mechanical Specifications
This section documents the mechanical specifications of the boxed Pentium III processor fan
heatsinks. Baseboard manufacturers and system designers should take into account the spacial
requirement for the boxed Pentium III processor in the S.E.C.C.2 package.
6.2.1
Boxed Processor Fan Heatsink Dimensions
The boxed processor is shipped with an attached fan heatsink. Clearance is required around the fan
heatsink to ensure unimpeded air flow for proper cooling. Spacial requirements and dimensions for
the boxed processor in S.E.C.C.2 package are shown in Figure 50 (Side View), Figure 51 (Front
View), and Figure 52 (Top View). All dimensions are in inches.
Figure 49. Boxed Intel Pentium III Processor in the S.E.C.C.2 Packaging
(Fan Power Cable Not Shown)
Fan Power
Connector
Fan
Shroud
Heatsink
S.E.C.C. 2 Cover
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