- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄166791 > BX80525U667256E (INTEL CORP) 32-BIT, 667 MHz, MICROPROCESSOR, XMA PDF資料下載
參數(shù)資料
| 型號(hào)： | BX80525U667256E |
| 廠商： | INTEL CORP |
| 元件分類： | 微控制器/微處理器 |
| 英文描述： | 32-BIT, 667 MHz, MICROPROCESSOR, XMA |
| 文件頁數(shù)： | 59/102頁 |
| 文件大?。?/td> | 878K |
| 代理商： | BX80525U667256E |
第1頁第2頁第3頁第4頁第5頁第6頁第7頁第8頁第9頁第10頁第11頁第12頁第13頁第14頁第15頁第16頁第17頁第18頁第19頁第20頁第21頁第22頁第23頁第24頁第25頁第26頁第27頁第28頁第29頁第30頁第31頁第32頁第33頁第34頁第35頁第36頁第37頁第38頁第39頁第40頁第41頁第42頁第43頁第44頁第45頁第46頁第47頁第48頁第49頁第50頁第51頁第52頁第53頁第54頁第55頁第56頁第57頁第58頁當(dāng)前第59頁第60頁第61頁第62頁第63頁第64頁第65頁第66頁第67頁第68頁第69頁第70頁第71頁第72頁第73頁第74頁第75頁第76頁第77頁第78頁第79頁第80頁第81頁第82頁第83頁第84頁第85頁第86頁第87頁第88頁第89頁第90頁第91頁第92頁第93頁第94頁第95頁第96頁第97頁第98頁第99頁第100頁第101頁第102頁
Pentium III Processor for the SC242 at 450 MHz to 800 MHz
6
Datasheet
39
S.E.C.C.2 Packaged Processor Substrate (CPUID 067xh) — Keep In Zones ... 60
40
S.E.C.C.2 Packaged Processor Substrate (CPUID 068xh) — Keep In Zones ... 60
41
S.E.C.C.2 Packaged Processor Substrate (CPUID 067xh) — Keep-Out Zone .. 61
42
S.E.C.C.2 Packaged Processor Substrate (CPUID 068xh) — Keep-Out Zone .. 61
43
Intel Pentium III Processor Markings (S.E.C.C.2 Package) ............................ 62
44
Substrate Deflection Away From Heat Sink ........................................................ 62
45
Substrate Deflection Toward the Heatsink.......................................................... 63
46
S.E.C.C.2 Packaged Processor Specifications................................................... 63
47
Processor Core Pad Via Assignments ................................................................ 73
48
Intel Pentium III Processor S.E.C.C. 2 Via Map .............................................. 84
49
Boxed Intel Pentium III Processor in the S.E.C.C.2 Packaging
(Fan Power Cable Not Shown) ........................................................................... 85
50
Side View Space Requirements for the Boxed Processor with
S.E.C.C.2 Packaging .......................................................................................... 86
51
Front View Space Requirements for the Boxed Processor with
S.E.C.C.2 Packaging .......................................................................................... 86
52
Top View Air Space Requirements for the Boxed Processor.............................. 87
53
Boxed Processor Fan Heatsink Power Cable Connector Description ................ 88
54
Recommended Baseboard Power Header Placement Relative to
Fan Power Connector and Intel Pentium III Processor ................................... 89
Tables
1
Processor Identification......................................................................................... 9
2
Related Documents............................................................................................. 10
3
Voltage Identification Definition .......................................................................... 17
4
System Bus Signal Groups ................................................................................. 19
5
Frequency Select Truth Table for BSEL[1:0] ...................................................... 20
6
Absolute Maximum Ratings (CPUID 067xh) ....................................................... 22
7
Absolute Maximum Ratings (CPUID 068xh) ....................................................... 23
8
Voltage and Current Specifications..................................................................... 24
9
AGTL+ Signal Groups DC Specifications ........................................................... 26
10
Non-AGTL+ Signal Group DC Specifications ..................................................... 27
11
AGTL+ Bus Specifications ................................................................................. 28
12
System Bus AC Specifications (Clock) at Processor Core Pins ........................ 29
13
Valid System Bus, Core Frequency, and Cache Bus Frequencies .................... 30
14
System Bus AC Specifications (AGTL+ Signal Group) at the
Processor Core Pins .......................................................................................... 30
15
System Bus AC Specifications (CMOS Signal Group) at the
Processor Core Pins .......................................................................................... 31
16
System Bus AC Specifications (Reset Conditions) ............................................ 31
17
System Bus AC Specifications (APIC Clock and APIC I/O) at the
Processor Core Pins .......................................................................................... 31
18
System Bus AC Specifications (TAP Connection) at the Processor
Core Pins ........................................................................................................... 32
19
BCLK, PICCLK, and PWRGOOD Signal Quality Specifications at the
Processor Core .................................................................................................. 36
20
100 MHz AGTL+ Signal Group Overshoot/Undershoot Tolerance .................... 40
21
133 MHz AGTL+ Signal Group Overshoot/Undershoot Tolerance .................... 41
22
33 MHz Non-AGTL+ Signal Group Overshoot/Undershoot Tolerance .............. 41
23
Signal Ringback Specifications for Signal Simulation ........................................ 43
24
AGTL+ and Non-AGTL+ Signal Groups Ringback Tolerance Specifications ..... 43
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| BX80532PC2500D | 32-BIT, 2500 MHz, MICROPROCESSOR, XMA |
| BX80532PG3200D | 32-BIT, 3200 MHz, MICROPROCESSOR, XGA478 |
| BXA10-48S3V3-S | 1-OUTPUT 8 W DC-DC REG PWR SUPPLY MODULE |
| BXA15-24S15 | 1-OUTPUT 15 W DC-DC REG PWR SUPPLY MODULE |
| BXA15-48S05-F | 1-OUTPUT 15 W DC-DC REG PWR SUPPLY MODULE |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| BX80525U700256 | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:Microprocessor |
| BX80525U733256 | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:Microprocessor |
| BX80525U750256 | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:Microprocessor |
| BX80525U800256 | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:Microprocessor |
| BX80525U800256EB | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:Microprocessor |
發(fā)布緊急采購，3分鐘左右您將得到回復(fù)。