參數(shù)資料
型號: BX80525U667256E
廠商: INTEL CORP
元件分類: 微控制器/微處理器
英文描述: 32-BIT, 667 MHz, MICROPROCESSOR, XMA
文件頁數(shù): 42/102頁
文件大?。?/td> 878K
代理商: BX80525U667256E
44
Datasheet
Pentium III Processor for the SC242 at 450 MHz to 800 MHz
3.3
AGTL+ and Non-AGTL+ Ringback Specifications and
Measurement Guidelines
Ringback refers to the amount of reflection seen after a signal has switched. The ringback
specification is the voltage that the signal rings back to after achieving its maximum absolute
value. (See Figure 16 for an illustration of ringback.) Excessive ringback can cause false signal
detection or extend the propagation delay. The ringback specification applies to the input pin of
each receiving agent. Violations of the signal ringback specification are not allowed under any
circumstances for both AGTL+ and non-AGTL+ signals.
When performing simulations to determine the impact of ringback, ESD diodes must be properly
characterized. The Intel provided Pentium III Processor I/O Buffer Models contain I/O capacitance
characterization. Therefore, removing the ESD diodes from the I/O buffer model will impact
results and may yield incorrect ringback. If other I/O buffer models are being used to characterize
Pentium III processor performance, care must be taken to ensure that ESD models account for the
I/O capacitance. See Table 24 for the signal ringback specifications for both AGTL+ and
non-AGTL+ signals for simulations at the processor core.
Figure 15. Maximum Acceptable AGTL+ and Non-AGTL+ Overshoot/Undershoot Waveform
Vss
Undershoot
Magnitude
=
V
TT - Signal
Overshoot
Magnitude
=
Signal - Vss
V
TT
2.3V
2.2V
2.1V
2.0V
1.635V
Max
Overshoot
Magnitude
Time Dependent
Overshoot
Converted Undershoot
Waveform
Undershoot
Magnitude
Time Dependent
Undershoot
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