參數(shù)資料
型號(hào)： BX80525U667256E
廠商： INTEL CORP
元件分類： 微控制器/微處理器
英文描述： 32-BIT, 667 MHz, MICROPROCESSOR, XMA
文件頁數(shù)： 49/102頁
文件大?。?/td> 878K
代理商： BX80525U667256E
50
Datasheet
Pentium III Processor for the SC242 at 450 MHz to 800 MHz
For S.E.C.C. packaged processors, the extended thermal plate is the attach location for all thermal
solutions. The maximum and minimum extended thermal plate temperatures are specified in
Table 25. For S.E.C.C.2 packaged processors, thermal solutions attach to the processor by
connecting through the substrate to the cover. The maximum and minimum temperatures of the
pertinent locations are specified in Table 26. A thermal solution should be designed to ensure the
temperature of the specified locations never exceeds these temperatures.
The total processor power is a result of heat dissipated by the processor core and L2 cache. The
overall system chassis thermal design must comprehend the entire processor power. In S.E.C.C.
packaged processors, the extended thermal plate power is a component of this power, and is
primarily composed of the processor core and the L2 cache dissipating heat through the extended
thermal plate. The heatsink need only be designed to dissipate the extended thermal plate power.
See Table 25 for current Pentium III processor S.E.C.C. thermal design specifications.
No extended thermal plate exists for S.E.C.C.2 packaged processors, so thermal solutions have to
attach directly to the processor core package. The total processor power dissipated by an S.E.C.C.2
processor is a combination of heat dissipated by both the processor core and L2 cache. Pentium III
processors that use a “Discrete” L2 cache have a separate TCASE specification (Table 26) for the
surface mounted BSRAM components on the substrate. TJUNCTION encompasses the L2 cache for
processors that utilize the “Advanced Transfer Cache”, therefore no separate cache measurement is
required.
Specifics on how to measure these specifications are outlined in AP-905, Pentium III Processor
Thermal Design Guidelines (Order Number 245087).
4.1.1
Thermal Diode
The Pentium III processor incorporates an on-die diode that may be used to monitor the die
temperature (junction temperature). A thermal sensor located on the baseboard, or a stand-alone
measurement kit, may monitor the die temperature of the Pentium III processor for thermal
management or instrumentation purposes. Table 27 and Table 28 provide the diode parameter and
interface specifications.
NOTES:
1. Intel does not support or recommend operation of the thermal diode under reverse bias.
2. At room temperature with a forward bias of 630 mV.
3. n_ideality is the diode ideality factor parameter, as represented by the diode equation:
I=Io(e (Vd*q)/(nkT) - 1).
4. This specification applies to the Pentium III processor with CPUID=067xh.
5. This specification applies to the Pentium III processor with CPUID=068xh.
Table 27. Thermal Diode Parameters1
Symbol
Min
Typ
Max
Unit
Notes
Iforward bias
5
500
uA
1
n_ideality
1.0000
1.0057
1.0065
1.0080
1.0173
1.0125
2, 3, 4
2, 3, 5
Table 28. Thermal Diode Interface
Pin Name
SC 242 Connector Signal #
Pin Description
THERMDP
B14
diode anode (p_junction)
THERMDN
B15
diode cathode (n_junction)
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