參數(shù)資料
型號(hào): ADSP-21371BSWZ-2B
廠商: Analog Devices Inc
文件頁數(shù): 40/48頁
文件大小: 0K
描述: IC DSP 32BIT 266MHZ 208-LQFP
產(chǎn)品培訓(xùn)模塊: SHARC Processor Overview
標(biāo)準(zhǔn)包裝: 1
系列: SHARC®
類型: 浮點(diǎn)
接口: DAI,DPI
時(shí)鐘速率: 266MHz
非易失內(nèi)存: ROM(512 kB)
芯片上RAM: 128kB
電壓 - 輸入/輸出: 3.30V
電壓 - 核心: 1.20V
工作溫度: -40°C ~ 85°C
安裝類型: 表面貼裝
封裝/外殼: 208-LQFP 裸露焊盤
供應(yīng)商設(shè)備封裝: 208-LQFP-EP(28x28)
包裝: 托盤
Table 42 airflow measurements comply with JEDEC standards
JESD51-2 and JESD51-6 and the junction-to-board measure
ment complies with JESD51-8. Test board design complies with
JEDEC standards JESD51-7 (MQFP). The junction-to-case
measurement complies with MIL- STD-883. All measurements
use a 2S2P JEDEC test board.
The ADSP-21371 processor is rated for performance over the
temperature range specified in Operating Conditions on
O
U
T
P
D
E
L
A
Y
R
H
(n
s
)
THERMAL CHARACTERISTICS
To determine the junction temperature of the device while on
the application PCB, use:
where:
TJ = junction temperature °C
TCASE = case temperature (°C) measured at the top center of the
package
Ψ
JT = junction-to-top (of package) characterization parameter
is the Typical value from Table 42.
PD = power dissipation
Values of θJA are provided for package comparison and PCB
design considerations. θJA can be used for a first order approxi
mation of TJ by the equation:
where:
TA = ambient temperature °C
Values of θJC are provided for package comparison and PCB
design considerations when an external heatsink is required.
ADSP-21371
Values of θJB are provided for package comparison and PCB
design considerations. Note that the thermal characteristics val
10
0
200
50
100
150
Y = 0.0488X - 1.5923
ues provided in Table 42 are modeled values.
8
Table 42. Thermal Characteristics for 208-Lead MQFP
6
4
2
0
-2
-4
Parameter
Condition
Typical
Unit
θJA
Airflow = 0 m/s
30.82
°C/W
θJMA
Airflow = 1 m/s
27.53
°C/W
θJMA
Airflow = 2 m/s
26.22
°C/W
θJC
14.04
°C/W
ΨJT
Airflow = 0 m/s
2.0
°C/W
ΨJMT
Airflow = 1 m/s
2.65
°C/W
ΨJMT
Airflow = 2 m/s
3.12
°C/W
LOAD CAPACITANCE (pF)
Figure 39. Typical Output Delay or Hold vs. Load Capacitance
(at Ambient Temperature)
T
J = TCASE + (ΨJT × PD)
T
J = TA + (θJA × PD)
Rev. 0
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Page 45 of 48
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June 2007
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