參數(shù)資料
型號(hào)： ADATE207BBPZ
廠商： ANALOG DEVICES INC
元件分類： 消費(fèi)家電
英文描述： Quad Pin Timing Formatter
中文描述： SPECIALTY CONSUMER CIRCUIT, PBGA256
封裝： ROHS COMPLIANT, MO-192-BAL-2, LBGA-256
文件頁數(shù)： 6/36頁
文件大小： 374K
代理商： ADATE207BBPZ
ADATE207
ABSOLUTE MAXIMUM RATINGS
Rev. 0 | Page 6 of 36
Table 3.
Parameter
VDD
Digital Inputs
Resistor Termination pins
Resistor Termination Current
Termination Pad Current
Junction Temperature
Storage Temperature
Rating
0.3 V to +2.8 V
0.3 V to VDD + 0.3 V
0.3 to VDD + 0.3 V
12 mA max
12 mA max
125°C
40 to 125°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Table 4. Recommended Operating/Environmental
Conditions
Parameter
VDD
Case Temperature (T
C
)
Relative Humidity
(Noncondensing)
Min
2.375
Typ
2.5
85
Max
2.625
85
Unit
V
°C
%
THERMAL RESISTANCE
Table 5. Thermal Resistance
Package Type
256-Lead BGA_ED
In Still Air
200 LFPM
400 LFPM
θ
JA
14.3
12.0
11.2
θ
JC
1.5
Unit
°C/W
°C/W
°C/W
°C/W
BYPASSING SCHEME
For decoupling, best practice suggests that to preserve as much
of the plane-to-plane capacitance as possible, do not perforate
the planes for VSS and VDD. Secondly, it is advisable to decouple
VDD to VSS by using 0.1 μF high frequency ceramic capacitors.
The trace to the capacitor should be kept to an absolute minimum
length. It is recommend that one capacitor be placed in the
corner of the chip and one in the middle of each side for a total
of eight capacitors for VDD to VSS. Furthermore, decouple
IOVDD to IOVSS on each side of the device. It is recommended
that 10 μF tantalum or ceramic capacitors be used for low
frequency decoupling around the device. It is not important for
these capacitors to be close to the device.
Table 6. Data Table for 256-Lead Ball Grid Array, Thermally
Enhanced, 27 mm × 27 mm Body
Minimum
(mm)
A
A1
0.50
A2
0.60
D
26.90
D1
24.03
E
26.90
E1
24.03
b
0.60
e
aaa
bbb
ccc
ddd
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fff
S
Dimension
Nominal
(mm)
0.60
0.80
27.00
24.13
27.00
24.13
0.75
1.27
0.20
0.25
0.35
0.20
0.30
0.15
0.635
Maximum
(mm)
1.70
0.70
1.00
27.10
24.23
27.10
24.23
0.90
ESD CAUTION
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