
2001 Microchip Technology Inc.
DS35007B-page 51
PIC16F84A
9.1
DC Characteristics
PIC16LF84A-04
(Commercial, Industrial)
Standard Operating Conditions (unless otherwise stated)
Operating temperature
0
°
C
≤
T
A
≤
+70
°
C (commercial)
-40
°
C
≤
T
A
≤
+85
°
C (industrial)
-40
°
C
≤
T
A
≤
+125
°
C (extended)
PIC16F84A-04
(Commercial, Industrial, Extended)
PIC16F84A-20
(Commercial, Industrial, Extended)
Standard Operating Conditions (unless otherwise stated)
Operating temperature
0
°
C
≤
T
A
≤
+70
°
C (commercial)
-40
°
C
≤
T
A
≤
+85
°
C (industrial)
-40
°
C
≤
T
A
≤
+125
°
C (extended)
Param
No.
Symbol
Characteristic
Min
Typ Max Units
Conditions
V
DD
Supply Voltage
D001
D001
D001A
D002
16LF84A
16F84A
2.0
4.0
4.5
1.5
—
—
—
—
5.5
5.5
5.5
—
V
V
V
V
XT, RC, and LP osc configuration
XT, RC and LP osc configuration
HS osc configuration
Device in SLEEP mode
V
DR
RAM Data Retention
Voltage
(Note 1)
V
DD
Start Voltage
to ensure
internal Power-on Reset
signal
V
DD
Rise Rate
to ensure
internal Power-on Reset
signal
Supply Current (Note 2)
D003
V
POR
—
Vss
—
V
See section on Power-on Reset for details
D004
S
VDD
0.05
—
—
V/ms
I
DD
D010
16LF84A
—
1
4
mA
RC and XT osc configuration
(Note 4)
F
OSC
= 2.0 MHz, V
DD
= 5.5V
RC and XT osc configuration
(Note 4)
F
OSC
= 4.0 MHz, V
DD
= 5.5V
RC and XT osc configuration
(Note 4)
F
OSC
= 4.0 MHz, V
DD
= 5.5V
(During FLASH programming)
HS osc configuration (PIC16F84A-20)
F
OSC
= 20 MHz, V
DD
= 5.5V
LP osc configuration
F
OSC
= 32 kHz, V
DD
= 2.0V, WDT disabled
D010
D010A
D013
16F84A
—
—
—
1.8
3
10
4.5
10
20
mA
mA
mA
D014
16LF84A
—
15
45
μ
A
Legend: Rows with standard voltage device data only are shaded for improved readability.
Data in "Typ" column is at 5.0V, 25°C unless otherwise stated. These parameters are for design guidance
only and are not tested.
NR
Not rated for operation.
Note 1:
This is the limit to which V
DD
can be lowered without losing RAM data.
2:
The supply current is mainly a function of the operating voltage and frequency. Other factors, such as I/O
pin loading and switching rate, oscillator type, internal code execution pattern, and temperature also have
an impact on the current consumption.
The test conditions for all I
DD
measurements in active operation mode are:
OSC1 = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to V
DD
,
T0CKI = V
DD
, MCLR = V
DD
; WDT enabled/disabled as specified.
3:
The power-down current in SLEEP mode does not depend on the oscillator type. Power-down current is
measured with the part in SLEEP mode, with all I/O pins in hi-impedance state and tied to V
DD
and V
SS
.
4:
For RC osc configuration, current through R
EXT
is not included. The current through the resistor can be
estimated by the formula I
R
= V
DD
/2R
EXT
(mA) with R
EXT
in kOhm.
5:
The
current is the additional current consumed when this peripheral is enabled. This current should be
added to the base I
DD
measurement.