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參數(shù)資料
| 型號(hào)： | 0W888-002-XTP |
| 廠商： | ON SEMICONDUCTOR |
| 元件分類： | 數(shù)字信號(hào)處理 |
| 英文描述： | BelaSigna 250 - 16 bit Audio Processor, Full Stereo 2-in, 2-out; Package: LFBGA 64, 7x7; No of Pins: 64; Container: Tape and Reel; Qty per Container: 1500 |
| 中文描述： | 0-BIT, 50 MHz, MIXED DSP, PBGA64 |
| 封裝： | 7 X 7 MM, GREEN, LFBGA-64 |
| 文件頁數(shù)： | 26/34頁 |
| 文件大?。?/td> | 935K |
| 代理商： | 0W888-002-XTP |
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Rev. 7 | Page 32 of 34 | www.onsemi.com
BelaSigna 250
5.1.4. Sample Label Standard
Figure 20: Sample Label
5.2 Re-flow Information
The re-flow profile depends on the equipment that is used for the re-flow and the assembly that is being re-flowed. Use the following
table from the JEDEC Standard 22-A113D and J-STD-020D.01 as a guideline:
Table 13: Re-flow Information
Profile Feature
Pb-free Assembly
Average Ramp-Up Rate (TL to TP)
3°C/second maximum
Preheat
Temperature minimum (TSMIN)
150°C
Temperature maximum (TSMAX)
200°C
Time (min. to max.) (ts)
60-180 seconds
TSMAX to TL
Ramp-up rate
3°C/second maximum
Time Maintained Above
Temperature (TL)
217°C
Time (tL)
60-150 seconds
Peak Temperature (TP)
260 +0/-5°C
Time within 5°C of Actual Peak Temperature
20-40 seconds
Ramp-Down Rate
6°C/second maximum
Time 25°C to Peak Temperature
8 minutes maximum
5.3 Electrostatic Discharge (ESD) Sensitive Device
CAUTION: ESD sensitive device. Permanent damage may occur on devices subjected to high-energy electrostatic
discharges. Proper ESD precautions in handling, packaging and testing are recommended to avoid performance degradation or loss of
functionality. Device is 2kV HBM ESD qualified.
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