參數(shù)資料
型號(hào): μPD424210
廠商: NEC Corp.
英文描述: 16 bits CMOS Dynamic RAM with Optional EDO.(16M 同步動(dòng)態(tài)RAM)
中文描述: 16位的CMOS動(dòng)態(tài)隨機(jī)存儲(chǔ)器的任擇易都。(1,600同步動(dòng)態(tài)RAM)的
文件頁(yè)數(shù): 45/48頁(yè)
文件大?。?/td> 351K
代理商: ΜPD424210
μ
PD424210
45
μ
PD424210LE: 40-pin plastic SOJ (300 mil)
Soldering process
Soldering conditions
Infrared ray reflow
Peak temperature of package surface: 235 C or lower,
Reflow time: 30 seconds or less (210 C or higher),
Number of reflow processes: MAX. 3
Exposure limit: 7 days
Note
(20 hours pre-baking is required at 125 C afterwards)
VPS
Peak temperature of package: 215 C or lower,
Reflow time: 40 seconds or less (200 C or higher),
Number of reflow processes: MAX. 3
Exposure limit: 7 days
Note
(20 hours pre-baking is required at 125 C afterwards)
Partial heating method
Terminal temperature: 300 C or lower,
Time: 3 seconds or less (Per side of the package).
Note
Exposure limit before soldering after dry-pack package is opened.
Storage conditions: 25 C and relative humidity at 65 % or less.
Caution
Do not apply more than one soldering method at any one time, except for “Partial heating
method”.
Symbol
IR35-207-3
VP15-207-3
————
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