參數(shù)資料
型號： XRT75R12DIB-L
廠商： Exar Corporation
文件頁數(shù)： 126/133頁
文件大?。?/td> 0K
描述： IC LIU E3/DS3/STS-1 12CH 420TBGA
標(biāo)準(zhǔn)包裝： 40
類型： 線路接口裝置（LIU）
驅(qū)動器/接收器數(shù)： 12/12
規(guī)程： DS3，E3，STS-1
電源電壓： 3.135 V ~ 3.465 V
安裝類型： 表面貼裝
封裝/外殼： 420-LBGA 裸露焊盤
供應(yīng)商設(shè)備封裝： 420-TBGA（35x35）
包裝： 托盤
XRT75R12D
88
TWELVE CHANNEL E3/DS3/STS-1 LINE INTERFACE UNIT WITH SONET DESYNCHRONIZER
REV. 1.0.3
transported across the SDH network (from one PTE to the PTE at the other end of the SDH network). Once
this SDH signal arrives at the remote PTE, this DS3 or E3 signal will then be extracted from the SDH signal,
and will be output to some other DS3/E3 Terminal Equipment for further processing.
Figure 37 presents an illustration of this approach to transporting DS3 data over a SONET Network
As mentioned above a DS3 or E3 signal will be asynchronously mapped into a SONET or SDH signal and then
transported over the SONET or SDH network. At the remote PTE this DS3 or E3 signal will be extracted (or
de-mapped) from this SONET or SDH signal, where it will then be routed to DS3 or E3 terminal equipment for
further processing.
In order to insure that this "de-mapped" DS3 or E3 signal can be routed to any industry-standard DS3 or E3
terminal equipment, without any complications or adverse effect on the network, the Telcordia and ITU-T
standard committees have specified some limits on both the Intrinsic Jitter and Wander that may exist within
these DS3 or E3 signals as they are de-mapped from SONET/SDH. As a consequence, all PTEs that maps
and de-mapped DS3/E3 signals into/from SONET/SDH must be designed such that the DS3 or E3 data that is
de-mapped from SONET/SDH by these PTEs must meet these Intrinsic Jitter and Wander requirements.
As mentioned above, the LIU can assist the System Designer (of SONET/SDH PTE) by ensuring that their
design will meet these Intrinsic Jitter and Wander requirements.
This section of the data sheet will present the following information to the user.
Some background information on Mapping DS3/E3 signals into SONET/SDH and de-mapping DS3/E3
signals from SONET/SDH.
A brief discussion on the causes of jitter and wander within a DS3 or E3 signal that mapped into a SONET/
SDH signal, and is transported across the SONET/SDH Network.
A brief review of these Intrinsic Jitter and Wander requirements in both SONET and SDH applications.
A brief review on the Intrinsic Jitter and Wander measurement results (of a de-mapped DS3 or E3 signal)
whenever the LIU device is used in a system design.
FIGURE 37. A SIMPLE ILLUSTRATION OF A DS3 SIGNAL BEING MAPPED INTO AND TRANSPORTED OVER THE SONET
NETWORK
PTE
SONET
Network
DS3 Data
相關(guān)PDF資料
PDF描述
XRT75R12IB-L IC LIU E3/DS3/STS-1 12CH 420TBGA
XRT75VL00DIV IC LIU E3/DS3/STS-1 1CH 52TQFP
XRT75VL00IV-F IC LIU E3/DS3/STS-1 1CH 52TQFP
XRT79L71IB-F IC LIU/FRAMER DS3/E3 1CH 208BGA
XRT81L27IV-F IC LIU EI 7CH 3.3V 128TQFP
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
XRT75R12ES 功能描述:時鐘合成器/抖動清除器 12CH T3/E3/STS1LIUJA 3.3V W/REDUNDANCY RoHS:否 制造商:Skyworks Solutions, Inc. 輸出端數(shù)量: 輸出電平: 最大輸出頻率: 輸入電平: 最大輸入頻率:6.1 GHz 電源電壓-最大:3.3 V 電源電壓-最小:2.7 V 封裝 / 箱體:TSSOP-28 封裝:Reel
XRT75R12IB 功能描述:外圍驅(qū)動器與原件 - PCI 12CH E3/DS3/STS W/JITTER R3 TECH RoHS:否 制造商:PLX Technology 工作電源電壓: 最大工作溫度: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FCBGA-1156 封裝:Tray
XRT75R12IB-F 功能描述:外圍驅(qū)動器與原件 - PCI 12 Channel 3.3V-5V temp -45 to 85C RoHS:否 制造商:PLX Technology 工作電源電壓: 最大工作溫度: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FCBGA-1156 封裝:Tray
XRT75R12IB-L 功能描述:LIN 收發(fā)器 Attenuator RoHS:否 制造商:NXP Semiconductors 工作電源電壓: 電源電流: 最大工作溫度: 封裝 / 箱體:SO-8
XRT75VL00 制造商:EXAR 制造商全稱:EXAR 功能描述:E3/DS3/STS-1 LINE INTERFACE UNIT WITH JITTER ATTENUATOR
發(fā)布緊急采購，3分鐘左右您將得到回復(fù)。

采購需求

(若只采購一條型號，填寫一行即可)

發(fā)布成功！您可以繼續(xù)發(fā)布采購。也可以進入我的后臺，查看報價

發(fā)布成功！您可以繼續(xù)發(fā)布采購。也可以進入我的后臺，查看報價

*型號 *數(shù)量 廠商 批號 封裝
添加更多采購

我的聯(lián)系方式

*
*
*