參數(shù)資料
型號(hào)： W3H32M64E-533SBC
廠商： MICROSEMI CORP-PMG MICROELECTRONICS
元件分類： DRAM
英文描述： 32M X 64 DDR DRAM, 0.65 ns, PBGA208
封裝： 16 X 20 MM, 1 MM PITCH, PLASTIC, BGA-208
文件頁(yè)數(shù)： 7/30頁(yè)
文件大?。?/td> 958K
代理商： W3H32M64E-533SBC
W3H32M64E-XSBX
15
White Electronic Designs Corporation (602) 437-1520 www.whiteedc.com
White Electronic Designs
September 2009
Rev. 11
White Electronic Designs Corp. reserves the right to change products or specications without notice.
EXTENDED MODE REGISTER 2
The extended mode register 2 (EMR2) controls functions
beyond those controlled by the mode register. Currently
all bits in EMR2 are reserved, as shown in Figure 8. The
EMR2 is programmed via the LM command and will
retain the stored information until it is programmed again
or the device loses power. Reprogramming the EMR will
not alter the contents of the memory array, provided it is
performed correctly.
EMR2 must be loaded when all banks are idle and no
bursts are in progress, and the controller must wait the
specified time tMRD before initiating any subsequent
operation. Violating either of these requirements could
result in unspecied operation.
EXTENDED MODE REGISTER 3
The extended mode register 3 (EMR3) controls functions
beyond those controlled by the mode register. Currently,
all bits in EMR3 are reserved, as shown in Figure 9.
The EMR3 is programmed via the LM command and will
retain the stored information until it is programmed again
or the device loses power. Reprogramming the EMR will
not alter the contents of the memory array, provided it is
performed correctly.
EMR3 must be loaded when all banks are idle and no
bursts are in progress, and the controller must wait the
specied time tMRD before initiating any subsequent
operation. Violating either of these requirements could
result in unspecied operation.
COMMAND TRUTH TABLES
The following tables provide a quick reference of DDR2
SDRAM available commands, including CKE power-down
modes, and bank-to-bank commands.
FIGURE 9 – EXTENDED MODE REGISTER 3 (EMR3) DEFINITION
A9
A7 A 6 A5 A4 A3
0
A
1
A
2
A
8
A
Extended Mo de
Register (Ex)
Address Bus
97
6
5
4
3
0
1
2
8
A10
A12 A11
BA0
BA1
10
11
12
13
14
15
A13
0
1
0
1
Mode Register Definition
Mo de Register (MR)
Extended Mo de Register (EMR)
Extended Mo de Register (EMR2)
Extended Mo de Register (EMR3)
M15
0
1
M14
EMR3
01
Note: 1. E13 (A13)-E0 (A0) are reserved for future use and must be programmed to
"0." A13 is not used in this device.
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
W3H32M64E-533SBI 制造商:Microsemi Corporation 功能描述:32M X 64 DDR2, 1.8V, 533MHZ, 208PBGA INDUSTRIAL TEMP. - Bulk
W3H32M64E-533SBM 制造商:Microsemi Corporation 功能描述:32M X 64 DDR2, 1.8V, 533MHZ, 208PBGA MIL-TEMP. - Bulk
W3H32M64E-667ES 制造商:WEDC 制造商全稱:White Electronic Designs Corporation 功能描述:32M x 64 DDR2 SDRAM 208 PBGA Multi-Chip Package
W3H32M64E-667ESC 制造商:WEDC 制造商全稱:White Electronic Designs Corporation 功能描述:32M x 64 DDR2 SDRAM 208 PBGA Multi-Chip Package
W3H32M64E-667ESI 制造商:WEDC 制造商全稱:White Electronic Designs Corporation 功能描述:32M x 64 DDR2 SDRAM 208 PBGA Multi-Chip Package
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