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參數(shù)資料
| 型號： | W3H32M64E-533SBC |
| 廠商： | MICROSEMI CORP-PMG MICROELECTRONICS |
| 元件分類： | DRAM |
| 英文描述： | 32M X 64 DDR DRAM, 0.65 ns, PBGA208 |
| 封裝： | 16 X 20 MM, 1 MM PITCH, PLASTIC, BGA-208 |
| 文件頁數(shù)： | 22/30頁 |
| 文件大小： | 958K |
| 代理商： | W3H32M64E-533SBC |
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W3H32M64E-XSBX
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White Electronic Designs Corporation (602) 437-1520 www.whiteedc.com
White Electronic Designs
September 2009
Rev. 11
White Electronic Designs Corp. reserves the right to change products or specications without notice.
Document Title
32M x 64 DDR2 SDRAM 208 PBGA Multi-Chip Package
Revision History
Rev #
History
Release Date
Status
Rev 0
Initial Release
June 2005
Advanced
Rev 1
Changes (Pg. 1, 3, 5)
1.1 Change max package width to 16mm
August 2005
Advanced
Rev 2
Changes (pg. 1, 3, 6)
2.1 Pinout added
October 2005
Advanced
Rev 3
Changes (Pg. 1, 3, 6)
3.1 Change all VCCQ to VCC
October 2005
Advanced
Rev 4
Changes (Pg. All)
4.1 Change status to Preliminary
4.2 Add AC, DC, and timing detail
February 2007
Preliminary
Rev 5
Changes (Pg. All)
5.1 Change status to Final
5.2 Add 667 Mb/s data rate timing
May 2007
Final
Rev 6
Changes (Pg. All)
6.1 Change SPACE SAVINGS to Space savings
6.2 Change VCCQ is common to VCC
6.3 Change Pg, 7 to Pg.8 and Pg. 8 to Pg. 7
6.4 Change Pg. 16 single bank charge BA1/SA0 to Ba and
bank activate We# to H
6.5 Change tWT to tWT
6.6 Change Mbs to Mb/s
October 2008
Final
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| W3H32M64E-533SBI | 制造商:Microsemi Corporation 功能描述:32M X 64 DDR2, 1.8V, 533MHZ, 208PBGA INDUSTRIAL TEMP. - Bulk |
| W3H32M64E-533SBM | 制造商:Microsemi Corporation 功能描述:32M X 64 DDR2, 1.8V, 533MHZ, 208PBGA MIL-TEMP. - Bulk |
| W3H32M64E-667ES | 制造商:WEDC 制造商全稱:White Electronic Designs Corporation 功能描述:32M x 64 DDR2 SDRAM 208 PBGA Multi-Chip Package |
| W3H32M64E-667ESC | 制造商:WEDC 制造商全稱:White Electronic Designs Corporation 功能描述:32M x 64 DDR2 SDRAM 208 PBGA Multi-Chip Package |
| W3H32M64E-667ESI | 制造商:WEDC 制造商全稱:White Electronic Designs Corporation 功能描述:32M x 64 DDR2 SDRAM 208 PBGA Multi-Chip Package |
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