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參數(shù)資料
| 型號： | W3H32M64E-533SBC |
| 廠商： | MICROSEMI CORP-PMG MICROELECTRONICS |
| 元件分類： | DRAM |
| 英文描述： | 32M X 64 DDR DRAM, 0.65 ns, PBGA208 |
| 封裝： | 16 X 20 MM, 1 MM PITCH, PLASTIC, BGA-208 |
| 文件頁數(shù)： | 24/30頁 |
| 文件大?。?/td> | 958K |
| 代理商： | W3H32M64E-533SBC |
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W3H32M64E-XSBX
30
White Electronic Designs Corporation (602) 437-1520 www.whiteedc.com
White Electronic Designs
September 2009
Rev. 11
White Electronic Designs Corp. reserves the right to change products or specications without notice.
Document Title
32M x 64 DDR2 SDRAM 208 PBGA Multi-Chip Package
Revision History Continued
Rev #
History
Release Date
Status
Rev 7
Changes (Pg. 1)
7.1 Remove "user congurable as 2 x 32M x 32".
June 2009
Final
Rev 8
Changes (Pg. 25)
8.1 AC Timing Parameters:(667Mbs and 533Mbs) change
tAC(max): +650ps, tAC(min): -550ps, tDQSCK(max): +650ps,
tDQSCK(min): -550ps, tDH: +500ps.
July 2009
Final
Rev 9
Changes (Pg. 1, 2)
9.1 Add "user congurable as 2 x 32M x 32"; rescind Rev 7.
9.2 Change functional block diagram back to reect; WEB#,
RASB#, CASB#, CSB#.
August 2009
Final
Rev 10
Changes (Pg. 2, 3)
10.1 Change functional block diagram back to reect; WEA#,
RASA#, CASA#, CSA#.
10.2 Change pinout on page 3 to reect the changes to WEA#,
WEB#, CASA#, CASB#, RASA#, RASB#, CSA# and
CSB#.
August 2009
Final
Rev 11
Changes (Pg. 1, 3, 4, 5, 25, 26, 27)
11.1 Remove * on 667 data rate, delete"This product is subject
to change without notice."
11.2 Change drawing in Fig. 1 to 32M64.
11.3 Change ball E5 to DNU**.
11.4 Change Table 1: CKEA, CKEB, CSA#, RASA#, WEA#,
and RASB#, CASB# WEB#.
11. 5 Remove core from VCCQ, Remove row address bits from
DNU.
11.6 Change length to 0.793 in. (MAX)
11.7 Change tREFI to 1.95 for Military Temperature in all speeds
September 2009
Final
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| W3H32M64E-533SBI | 制造商:Microsemi Corporation 功能描述:32M X 64 DDR2, 1.8V, 533MHZ, 208PBGA INDUSTRIAL TEMP. - Bulk |
| W3H32M64E-533SBM | 制造商:Microsemi Corporation 功能描述:32M X 64 DDR2, 1.8V, 533MHZ, 208PBGA MIL-TEMP. - Bulk |
| W3H32M64E-667ES | 制造商:WEDC 制造商全稱:White Electronic Designs Corporation 功能描述:32M x 64 DDR2 SDRAM 208 PBGA Multi-Chip Package |
| W3H32M64E-667ESC | 制造商:WEDC 制造商全稱:White Electronic Designs Corporation 功能描述:32M x 64 DDR2 SDRAM 208 PBGA Multi-Chip Package |
| W3H32M64E-667ESI | 制造商:WEDC 制造商全稱:White Electronic Designs Corporation 功能描述:32M x 64 DDR2 SDRAM 208 PBGA Multi-Chip Package |
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