- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄245674 > W25Q80BVSSIG (WINBOND ELECTRONICS CORP) 8M X 1 SPI BUS SERIAL EEPROM, PDSO8 PDF資料下載
參數(shù)資料
| 型號(hào)： | W25Q80BVSSIG |
| 廠商： | WINBOND ELECTRONICS CORP |
| 元件分類： | PROM |
| 英文描述： | 8M X 1 SPI BUS SERIAL EEPROM, PDSO8 |
| 封裝： | 0.208 INCH, GREEN, PLASTIC, SOIC-8 |
| 文件頁數(shù)： | 46/75頁 |
| 文件大?。?/td> | 1055K |
| 代理商： | W25Q80BVSSIG |
第1頁第2頁第3頁第4頁第5頁第6頁第7頁第8頁第9頁第10頁第11頁第12頁第13頁第14頁第15頁第16頁第17頁第18頁第19頁第20頁第21頁第22頁第23頁第24頁第25頁第26頁第27頁第28頁第29頁第30頁第31頁第32頁第33頁第34頁第35頁第36頁第37頁第38頁第39頁第40頁第41頁第42頁第43頁第44頁第45頁當(dāng)前第46頁第47頁第48頁第49頁第50頁第51頁第52頁第53頁第54頁第55頁第56頁第57頁第58頁第59頁第60頁第61頁第62頁第63頁第64頁第65頁第66頁第67頁第68頁第69頁第70頁第71頁第72頁第73頁第74頁第75頁
W25Q80BV
- 50 -
9.2.31 Read Manufacturer / Device ID (90h)
The Read Manufacturer/Device ID instruction is an alternative to the Release from Power-down / Device
ID instruction that provides both the JEDEC assigned manufacturer ID and the specific device ID.
The Read Manufacturer/Device ID instruction is very similar to the Release from Power-down / Device ID
instruction. The instruction is initiated by driving the /CS pin low and shifting the instruction code “90h”
followed by a 24-bit address (A23-A0) of 000000h. After which, the Manufacturer ID for Winbond (EFh)
and the Device ID are shifted out on the falling edge of CLK with most significant bit (MSB) first as shown
in figure 29. The Device ID values for the W25Q80BV is listed in Manufacturer and Device Identification
table. If the 24-bit address is initially set to 000001h the Device ID will be read first and then followed by
the Manufacturer ID. The Manufacturer and Device IDs can be read continuously, alternating from one to
the other. The instruction is completed by driving /CS high.
/CS
CLK
DI
(IO
0)
DO
(IO
1)
Mode 0
Mode 3
0
1
2
3
4
5
6
7
Instruction (90h)
High Impedance
8
9
10
28
29
30
31
Address (000000h)
23
22
21
3
2
1
0
Device ID
*
/CS
CLK
DI
(IO
0)
DO
(IO
1)
32
33
34
35
36
37
38
39
Manufacturer ID (EFh)
40
41
42
44
45
46
7
6
5
4
3
2
1
0
*
43
31
0
Mode 0
Mode 3
= MSB
*
Figure 29. Read Manufacturer / Device ID Diagram
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| WED7G416IDE33ADC25 | 26M X 16 FLASH 3.3V PROM, DMA144 |
| W3HG64M72EEU806PD4IGG | 64M X 72 DDR DRAM MODULE, DMA200 |
| W3EG7262S265D3 | DDR DRAM MODULE, DMA184 |
| W7NCF08GH10CS3JM1G | FLASH 3.3V PROM MODULE, XMA50 |
| W7NCF08GH10CSA8HM1G | FLASH 3.3V PROM MODULE, XMA50 |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| W25Q80BVSSIG TR | 制造商:Winbond Electronics Corp 功能描述:SPIFLASH, 8M-BIT, 4KB UNIFORM 制造商:Winbond Electronics Corp 功能描述:IC FLASH 8MBIT 104MHZ 8SOIC |
| W25Q80BVSSIG/REELS | 制造商:Winbond Electronics Corp 功能描述: |
| W25Q80BVSSIG-T | 制造商:Winbond Electronics 功能描述:8MB SPI FLASH |
| W25Q80BVSSIP | 制造商:WINBOND 制造商全稱:Winbond 功能描述:8M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI |
| W25Q80BVZPAG | 制造商:WINBOND 制造商全稱:Winbond 功能描述:8M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI |
發(fā)布緊急采購，3分鐘左右您將得到回復(fù)。