參數(shù)資料
型號： W25B20-VSNIG
廠商： WINBOND ELECTRONICS CORP
元件分類： PROM
英文描述： 2M X 1 FLASH 2.7V PROM, PDSO8
封裝： 0.150 INCH, GREEN, PLASTIC, SOIC-8
文件頁數(shù)： 12/36頁
文件大?。?/td> 1424K
代理商： W25B20-VSNIG
W25B40/W25B40A
- 2 -
Table of Contents-
1.
GENERAL DESCRIPTION ......................................................................................................... 4
2.
FEATURES ................................................................................................................................. 4
3.
PIN CONFIGURATION...............................................................................................................5
4.
PIN DESCRIPTION..................................................................................................................... 5
4.1
Package Types ............................................................................................................... 5
4.2
Chip Select (/CS) ............................................................................................................ 5
4.3
Serial Data Output (DO) ................................................................................................. 6
4.4
Write Protect (/WP)......................................................................................................... 6
4.5
Hold (/HOLD) .................................................................................................................. 6
4.6
Serial Clock (CLK) .......................................................................................................... 6
4.7
Serial Data Input (DI) ...................................................................................................... 6
5.
BLOCK DIAGRAM (BOTTOM BOOT) ........................................................................................ 7
6.
BLOCK DIAGRAM (TOP BOOT-SPECIAL ORDER) ................................................................. 8
7.
FUNCTIONAL DESCRIPTION ................................................................................................... 9
7.1
SPI OPERATIONS ......................................................................................................... 9
7.1.1
SPI Modes........................................................................................................................9
7.1.2
Hold Function ...................................................................................................................9
7.2
WRITE PROTECTION.................................................................................................... 9
7.2.1
Write Protect Features......................................................................................................9
7.2.2
Write Protection using Power-down instruction...............................................................10
8.
CONTROL AND STATUS REGISTERS................................................................................... 10
8.1
STATUS REGISTER .................................................................................................... 10
8.1.1
BUSY..............................................................................................................................10
8.1.2
Write Enable Latch (WEL) ..............................................................................................10
8.1.3
Block Protect Bits (BP2, BP1, BP0)................................................................................11
8.1.4
Reserved Bits .................................................................................................................11
8.1.5
Status Register Protect (SRP) ........................................................................................11
8.1.6
Write Protection Operation - Bottom Boot Sector Organization ......................................12
8.1.7
Write Protection Operation - Top Boot Sector Organization (Special Order) ..................12
8.2
INSTRUCTIONS........................................................................................................... 12
8.2.1
Manufacturer and Device Identification...........................................................................13
8.2.2
Instruction Set
(1).............................................................................................................13
8.2.3
Write Disable (04h).........................................................................................................14
8.2.4
Write Enable (06h)..........................................................................................................14
8.2.5
Read Status Register (05h) ............................................................................................15
8.2.6
Write Status Register (01h) ............................................................................................16
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相關代理商/技術參數(shù)
參數(shù)描述
W25B40 制造商:WINBOND 制造商全稱:Winbond 功能描述:4M-BIT SERIAL FLASH MEMORY WITH BOOT AND PARAMETER SECTORS
W25B40A 制造商:WINBOND 制造商全稱:Winbond 功能描述:4M-BIT SERIAL FLASH MEMORY WITH BOOT AND PARAMETER SECTORS
W25B40AVSNIG 功能描述:IC FLASH 4MBIT 40MHZ 8SOIC RoHS:是 類別:集成電路 (IC) >> 存儲器 系列:SpiFlash® 標準包裝:1,000 系列:- 格式 - 存儲器:RAM 存儲器類型:移動 SDRAM 存儲容量:256M（8Mx32） 速度:133MHz 接口:并聯(lián) 電源電壓:1.7 V ~ 1.95 V 工作溫度:-40°C ~ 85°C 封裝/外殼:90-VFBGA 供應商設備封裝:90-VFBGA（8x13） 包裝:帶卷 (TR) 其它名稱:557-1327-2
W25B40AVSNIG T&R 功能描述:IC FLASH 4MBIT 40MHZ 8SOIC RoHS:是 類別:集成電路 (IC) >> 存儲器 系列:SpiFlash® 標準包裝:1,000 系列:- 格式 - 存儲器:RAM 存儲器類型:移動 SDRAM 存儲容量:256M（8Mx32） 速度:133MHz 接口:并聯(lián) 電源電壓:1.7 V ~ 1.95 V 工作溫度:-40°C ~ 85°C 封裝/外殼:90-VFBGA 供應商設備封裝:90-VFBGA（8x13） 包裝:帶卷 (TR) 其它名稱:557-1327-2
W25B40VSNIG 功能描述:IC FLASH 4MBIT 40MHZ 8SOIC RoHS:是 類別:集成電路 (IC) >> 存儲器 系列:SpiFlash® 標準包裝:1,000 系列:- 格式 - 存儲器:RAM 存儲器類型:移動 SDRAM 存儲容量:256M（8Mx32） 速度:133MHz 接口:并聯(lián) 電源電壓:1.7 V ~ 1.95 V 工作溫度:-40°C ~ 85°C 封裝/外殼:90-VFBGA 供應商設備封裝:90-VFBGA（8x13） 包裝:帶卷 (TR) 其它名稱:557-1327-2
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