參數(shù)資料
型號(hào)： UPD62AMC-XXX-5A4-A
元件分類： 微控制器/微處理器
英文描述： 4-BIT, MROM, 4 MHz, MICROCONTROLLER, PDSO20
封裝： 0.300 INCH, PLASTIC, SSOP-20
文件頁數(shù)： 51/62頁
文件大?。?/td> 272K
代理商： UPD62AMC-XXX-5A4-A
55
PD62A
Data Sheet U14474EJ2V0DS00
15. RECOMMENDED SOLDERING CONDITIONS
The
PD62A should be soldered and mounted under the following recommended conditions.
For the details of the recommended soldering conditions, refer to the document Semiconductor Device
Mounting Technology Manual (C10535E).
For soldering methods and conditions other than those recommended below, contact your NEC sales representa-
tives.
Table 15-1. Surface Mount Type Soldering Conditions
PD62AMC-×××-5A4: 20-pin plastic SSOP (7.62mm (300))
Soldering Method
Soldering Conditions
Recommended
Condition Symbol
Infrared reflow
Package peak temperature: 235
°C; Time: 30 seconds max. (at 210°C or higher);
IR35-00-3
Count: Three times or less
VPS
Package peak temperature: 215
°C; Time: 40 seconds. max. (at 200°C or higher);
VP15-00-3
Count: Three times or less
Wave soldering
Solder bath temperature: 260
°C max.; Time: 10 seconds max.; Count: once;
WS60-00-1
Preheating temperature: 120
°C max. (package surface temperature)
Partial heating
Pin temperature: 300
°C or less; Time: 3 seconds max. (per pin row)
—
Caution Do not use different soldering methods together (except for partial heating).
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