- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄98143 > SSTUB32868ET/S (NXP SEMICONDUCTORS) 32868 SERIES, POSITIVE EDGE TRIGGERED D FLIP-FLOP, TRUE OUTPUT, PBGA176 PDF資料下載
參數(shù)資料
| 型號(hào)： | SSTUB32868ET/S |
| 廠商： | NXP SEMICONDUCTORS |
| 元件分類： | 鎖存器 |
| 英文描述： | 32868 SERIES, POSITIVE EDGE TRIGGERED D FLIP-FLOP, TRUE OUTPUT, PBGA176 |
| 封裝： | 6 X 15 MM, 0.70 MM PITCH, LEAD FREE, PLASTIC, MO-246, SOT932-1, TFBGA-176 |
| 文件頁數(shù)： | 18/30頁 |
| 文件大?。?/td> | 254K |
| 代理商： | SSTUB32868ET/S |
第1頁第2頁第3頁第4頁第5頁第6頁第7頁第8頁第9頁第10頁第11頁第12頁第13頁第14頁第15頁第16頁第17頁當(dāng)前第18頁第19頁第20頁第21頁第22頁第23頁第24頁第25頁第26頁第27頁第28頁第29頁第30頁
SSTUB32868_4
All information provided in this document is subject to legal disclaimers.
NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 04 — 22 April 2010
25 of 30
NXP Semiconductors
SSTUB32868
1.8 V DDR2-800 configurable registered buffer with parity
13. Soldering of SMD packages
This text provides a very brief insight into a complex technology. A more in-depth account
of soldering ICs can be found in Application Note AN10365 “Surface mount reflow
soldering description”.
13.1 Introduction to soldering
Soldering is one of the most common methods through which packages are attached to
Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both
the mechanical and the electrical connection. There is no single soldering method that is
ideal for all IC packages. Wave soldering is often preferred when through-hole and
Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not
suitable for fine pitch SMDs. Reflow soldering is ideal for the small pitches and high
densities that come with increased miniaturization.
13.2 Wave and reflow soldering
Wave soldering is a joining technology in which the joints are made by solder coming from
a standing wave of liquid solder. The wave soldering process is suitable for the following:
Through-hole components
Leaded or leadless SMDs, which are glued to the surface of the printed circuit board
Not all SMDs can be wave soldered. Packages with solder balls, and some leadless
packages which have solder lands underneath the body, cannot be wave soldered. Also,
leaded SMDs with leads having a pitch smaller than ~0.6 mm cannot be wave soldered,
due to an increased probability of bridging.
The reflow soldering process involves applying solder paste to a board, followed by
component placement and exposure to a temperature profile. Leaded packages,
packages with solder balls, and leadless packages are all reflow solderable.
Key characteristics in both wave and reflow soldering are:
Board specifications, including the board finish, solder masks and vias
Package footprints, including solder thieves and orientation
The moisture sensitivity level of the packages
Package placement
Inspection and repair
Lead-free soldering versus SnPb soldering
13.3 Wave soldering
Key characteristics in wave soldering are:
Process issues, such as application of adhesive and flux, clinching of leads, board
transport, the solder wave parameters, and the time during which components are
exposed to the wave
Solder bath specifications, including temperature and impurities
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| SSTUG32865ET/S | SSTU SERIES, POSITIVE EDGE TRIGGERED D FLIP-FLOP, TRUE OUTPUT, PBGA160 |
| SSTUG32868ET/G | 32868 SERIES, POSITIVE EDGE TRIGGERED D FLIP-FLOP, COMPLEMENTARY OUTPUT, PBGA176 |
| SSTUP32866EC/S | 32866 SERIES, POSITIVE EDGE TRIGGERED D FLIP-FLOP, COMPLEMENTARY OUTPUT, PBGA96 |
| SSTV16857EC | POSITIVE EDGE TRIGGERED D FLIP-FLOP, TRUE OUTPUT, PBGA56 |
| SSTV16859DGG,118 | SSTV SERIES, POSITIVE EDGE TRIGGERED D FLIP-FLOP, TRUE OUTPUT, PDSO64 |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| SSTUB32870AHMLFT | 制造商:Integrated Device Technology Inc 功能描述:DDR2 REGISTER - Tape and Reel |
| SSTUB32871AHLF | 功能描述:IC REGIST BUFF 27BIT DDR2 96-BGA RoHS:否 類別:集成電路 (IC) >> 邏輯 - 專用邏輯 系列:- 產(chǎn)品變化通告:Product Discontinuation 25/Apr/2012 標(biāo)準(zhǔn)包裝:1,500 系列:74SSTV 邏輯類型:DDR 的寄存緩沖器 電源電壓:2.3 V ~ 2.7 V 位數(shù):14 工作溫度:0°C ~ 70°C 安裝類型:表面貼裝 封裝/外殼:48-TFSOP（0.240"，6.10mm 寬） 供應(yīng)商設(shè)備封裝:48-TSSOP 包裝:帶卷 (TR) |
| SSTUB32871AHLFT | 功能描述:IC REGIST BUFF 27BIT DDR2 96-BGA RoHS:否 類別:集成電路 (IC) >> 邏輯 - 專用邏輯 系列:- 產(chǎn)品變化通告:Product Discontinuation 25/Apr/2012 標(biāo)準(zhǔn)包裝:1,500 系列:74SSTV 邏輯類型:DDR 的寄存緩沖器 電源電壓:2.3 V ~ 2.7 V 位數(shù):14 工作溫度:0°C ~ 70°C 安裝類型:表面貼裝 封裝/外殼:48-TFSOP（0.240"，6.10mm 寬） 供應(yīng)商設(shè)備封裝:48-TSSOP 包裝:帶卷 (TR) |
| SSTUB32871AHMLF | 功能描述:IC REGIST BUFF 27BIT DDR2 96-BGA RoHS:是 類別:集成電路 (IC) >> 邏輯 - 專用邏輯 系列:- 產(chǎn)品變化通告:Product Discontinuation 25/Apr/2012 標(biāo)準(zhǔn)包裝:1,500 系列:74SSTV 邏輯類型:DDR 的寄存緩沖器 電源電壓:2.3 V ~ 2.7 V 位數(shù):14 工作溫度:0°C ~ 70°C 安裝類型:表面貼裝 封裝/外殼:48-TFSOP（0.240"，6.10mm 寬） 供應(yīng)商設(shè)備封裝:48-TSSOP 包裝:帶卷 (TR) |
| SSTUB32872AHLF | 功能描述:緩沖器和線路驅(qū)動(dòng)器 RoHS:否 制造商:Micrel 輸入線路數(shù)量:1 輸出線路數(shù)量:2 極性:Non-Inverting 電源電壓-最大:+/- 5.5 V 電源電壓-最小:+/- 2.37 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:MSOP-8 封裝:Reel |
發(fā)布緊急采購，3分鐘左右您將得到回復(fù)。