參數(shù)資料
型號: SSTUB32868ET/S
廠商: NXP SEMICONDUCTORS
元件分類: 鎖存器
英文描述: 32868 SERIES, POSITIVE EDGE TRIGGERED D FLIP-FLOP, TRUE OUTPUT, PBGA176
封裝: 6 X 15 MM, 0.70 MM PITCH, LEAD FREE, PLASTIC, MO-246, SOT932-1, TFBGA-176
文件頁數(shù): 12/30頁
文件大?。?/td> 254K
代理商: SSTUB32868ET/S
SSTUB32868_4
All information provided in this document is subject to legal disclaimers.
NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 04 — 22 April 2010
2 of 30
NXP Semiconductors
SSTUB32868
1.8 V DDR2-800 configurable registered buffer with parity
Two additional chip select inputs allow optional flexible enabling and disabling
Supports Stub Series Terminated Logic SSTL_18 data inputs
Differential clock (CK and CK) inputs
Supports Low Voltage Complementary Metal-Oxide Semiconductor (LVCMOS)
switching levels on the control and RESET inputs
Single 1.8 V supply operation (1.7 V to 2.0 V)
Available in 176-ball 6 mm
× 15 mm, 0.65 mm ball pitch TFBGA package
3.
Applications
400 MT/s to 800 MT/s high-density (for example, 2 rank by 4) DDR2 registered DIMMs
DDR2 Registered DIMMs (RDIMM) desiring parity checking functionality
4.
Ordering information
4.1 Ordering options
Table 1.
Ordering information
Type number
Solder process
Package
Name
Description
Version
SSTUB32868ET/G
Pb-free (SnAgCu solder ball
compound)
TFBGA176
plastic thin fine-pitch ball grid array package;
176 balls; body 6
× 15 × 0.7 mm
SOT932-1
SSTUB32868ET/S
Pb-free (SnAgCu solder ball
compound)
TFBGA176
plastic thin fine-pitch ball grid array package;
176 balls; body 6
× 15 × 0.7 mm
SOT932-1
Table 2.
Ordering options
Type number
Temperature range
SSTUB32868ET/G
Tamb = 0 °C to +70 °C
SSTUB32868ET/S
Tamb = 0 °C to +85 °C
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