參數(shù)資料
型號: SM320C30HFGM50
廠商: TEXAS INSTRUMENTS INC
元件分類: 數(shù)字信號處理
英文描述: 32-BIT, 50 MHz, OTHER DSP, CQFP196
封裝: NONCONDUCTIVE TIE BAR, CERAMIC, QFP-196
文件頁數(shù): 38/48頁
文件大小: 874K
代理商: SM320C30HFGM50
SMJ320C30
DIGITAL SIGNAL PROCESSOR
SOURCED FROM: SGUS014H -- FEBRUARY 1991 -- REVISED JUNE 2004
43
POST OFFICE BOX 1443
HOUSTON, TEXAS 77251--1443
MECHANICAL DATA (CONTINUED)
GA-GB (S-CPGA-P15 X 15)
CERAMIC PIN GRID ARRAY PACKAGE
4040114-8/C 04/96
Down
Cavity
Up
Cavity
Down
Cavity
Up
Outline
Small
Outline
Large
MAXIMUM PINS WITHIN MATRIX -- 225
C1
0.025 (0,63)
0.060 (1,52)
0.040 (1,02)
C
B1
0.095 (2,41)
0.205 (5,21)
0.110 (2,79)
B
A1
1.480 (37,59)
1.535 (38,99)
1.590 (40,38)
DIM
MIN
MAX
Notes
1.540 (39,12)
A
AorA1SQ
4 Places
DIA TYP
1.400 (35,56) TYP
0.050 (1,27) DIA
0.120 (3,05)
0.016 (0,41)
0.022 (0,55)
0.140 (3,56)
BorB1
CorC1
J
H
G
F
E
D
C
A
B
1 234 5 6 78 9
K
10
L
11 12
M
13
N
14
P
0.100 (2,54)
15
R
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. Index mark may appear on top or bottom depending on package vendor.
D. Pins are located within 0.010 (0,25) diameter of true position relative to each other at maximum material condition and within
0.030 (0,76) diameter relative to the edges of the ceramic.
E. This package can be hermetically sealed with metal lids or with ceramic lids using glass frit.
F. The pins can be gold plated or solder dipped.
G. Falls within MIL-STD-1835 CMGA7-PN and CMGA19-PN and JEDEC MO-067AG and MO-066AG, respectively
1.1
PARAMETER
Thermal Resistance Characteristics
°C/W
26.6
RθJC
RθJA
The above data applies to the SMJ320C30 181-pin PGA.
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