- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄385814 > SAA7712 (NXP Semiconductors N.V.) Sound effects DSP PDF資料下載
參數(shù)資料
| 型號(hào)： | SAA7712 |
| 廠商： | NXP Semiconductors N.V. |
| 英文描述： | Sound effects DSP |
| 中文描述： | DSP的音效 |
| 文件頁數(shù)： | 40/44頁 |
| 文件大?。?/td> | 178K |
| 代理商： | SAA7712 |
第1頁第2頁第3頁第4頁第5頁第6頁第7頁第8頁第9頁第10頁第11頁第12頁第13頁第14頁第15頁第16頁第17頁第18頁第19頁第20頁第21頁第22頁第23頁第24頁第25頁第26頁第27頁第28頁第29頁第30頁第31頁第32頁第33頁第34頁第35頁第36頁第37頁第38頁第39頁當(dāng)前第40頁第41頁第42頁第43頁第44頁
1999 Aug 05
40
Philips Semiconductors
Preliminary specification
Sound effects DSP
SAA7712H
19.5
Suitability of surface mount IC packages for wave and reflow soldering methods
Notes
1.
All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”
These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink
(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).
If wave soldering is considered, then the package must be placed at a 45
°
angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.
Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm;
it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
2.
3.
4.
5.
PACKAGE
SOLDERING METHOD
WAVE
REFLOW
(1)
BGA, SQFP
HLQFP, HSQFP, HSOP, HTSSOP, SMS
PLCC
(3)
, SO, SOJ
LQFP, QFP, TQFP
SSOP, TSSOP, VSO
not suitable
not suitable
(2)
suitable
not recommended
(3)(4)
not recommended
(5)
suitable
suitable
suitable
suitable
suitable
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| SAA8110G | Digital Signal Processor (DSP) for cameras(應(yīng)用于照相中的數(shù)字信號(hào)處理器) |
| SAA8122A | Digital Still Camera Processor (ImagIC family)(數(shù)字靜態(tài)照相處理器) |
| SAA8122AEL | Digital Still Camera Processor ImagIC family |
| SAB-C504-2R24M | 8-Bit CMOS Microcontroller |
| SAB-C504-2R40M | 8-Bit CMOS Microcontroller |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| SAA7712H | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Sound effects DSP |
| SAA7715 | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Digital Signal Processor |
| SAA7715H | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Digital Signal Processor |
| SAA7724H | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Car radio digital signal processor |
| SAA7740 | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Digital Audio Processing IC DAPIC |
發(fā)布緊急采購，3分鐘左右您將得到回復(fù)。