
1999 Aug 05
2
Philips Semiconductors
Preliminary specification
Sound effects DSP
SAA7712H
CONTENTS
1
1.1
1.2
2
3
4
5
6
7
8
8.1
8.1.1
8.1.2
8.1.3
8.1.4
8.1.5
8.1.6
8.1.7
8.1.8
8.1.9
8.1.10
8.2
8.2.1
8.2.2
8.2.3
8.3
8.3.1
8.3.2
8.3.3
8.4
8.4.1
8.4.2
8.5
8.6
8.6.1
8.6.2
8.6.3
8.6.4
8.6.5
8.6.6
8.6.7
FEATURES
Hardware features
Software features
APPLICATIONS
GENERAL DESCRIPTION
QUICK REFERENCE DATA
ORDERING INFORMATION
BLOCK DIAGRAM
PINNING INFORMATION
FUNCTIONAL DESCRIPTION
Analog outputs
Analog output circuit
DAC frequency
DACs
Upsample filter
Performance
Power-On Mute (POM)
Power-off plop suppression
Pin VREFDA
Internal DAC current reference
Supply of the analog outputs
I
2
S-bus inputs and outputs
Digital data stream formats
Slave I
2
S-bus inputs
Master I
2
S-bus inputs and outputs
Equalizer accelerator
Introduction
Configuration of equalizer sections
Overflow detection
Clock circuit and oscillator
General description
Supply of the crystal oscillator
Programmable phase-locked loop circuit
I
2
C-bus control
Introduction
Characteristics of the I
2
C-bus
Bit transfer
Start and stop conditions
Data transfer
Acknowledge
State of the I
2
C-bus interface during and after
Power-on reset
External control pins
Reset pin
Power supply connection and EMC
Test mode connections
8.7
8.8
8.9
8.10
9
9.1
9.2
9.3
9.4
9.5
9.6
10
11
12
13
14
15
16
17
18
19
19.1
I
2
C-BUS FORMAT
Addressing
Slave address (pin A0)
Write cycles
Read cycles
I
2
C-bus memory map summary
I
2
C-bus memory map details
LIMITING VALUES
THERMAL CHARACTERISTICS
DC CHARACTERISTICS
ANALOG OUTPUTS CHARACTERISTICS
OSCILLATOR CHARACTERISTICS
I
2
S-BUS TIMING CHARACTERISTICS
I
2
C-BUS TIMING CHARACTERISTICS
APPLICATION INFORMATION
PACKAGE OUTLINE
SOLDERING
Introduction to soldering surface mount
packages
Reflow soldering
Wave soldering
Manual soldering
Suitability of surface mount IC packages for
wave and reflow soldering methods
DEFINITIONS
LIFE SUPPORT APPLICATIONS
PURCHASE OF PHILIPS I
2
C COMPONENTS
19.2
19.3
19.4
19.5
20
21
22