參數(shù)資料
型號: S71JL064H80BAI020
廠商: ADVANCED MICRO DEVICES INC
元件分類: 存儲器
英文描述: SPECIALTY MEMORY CIRCUIT, PBGA73
封裝: 11.60 X 8 MM, FBGA-73
文件頁數(shù): 55/95頁
文件大?。?/td> 2244K
代理商: S71JL064H80BAI020
February 25, 2004 S71JLxxxHxx_00A1
S29JL064H
59
Pre l i m i n a r y
Command Definitions
Writing specific address and data commands or sequences into the command
register initiates device operations. Table 11 defines the valid register command
sequences. Writing incorrect address and data values or writing them in the im-
proper sequence may place the device in an unknown state. A reset command is
then required to return the device to reading array data.
All addresses are latched on the falling edge of WE# or CE#, whichever happens
later. All data is latched on the rising edge of WE# or CE#, whichever happens
first. Refer to the "AC Characteristics" section for timing diagrams.
Reading Array Data
The device is automatically set to reading array data after device power-up. No
commands are required to retrieve data. Each bank is ready to read array data
after completing an Embedded Program or Embedded Erase algorithm.
After the device accepts an Erase Suspend command, the corresponding bank
enters the erase-suspend-read mode, after which the system can read data from
any non-erase-suspended sector within the same bank. The system can read
array data using the standard read timing, except that if it reads at an address
within erase-suspended sectors, the device outputs status data. After completing
a programming operation in the Erase Suspend mode, the system may once
again read array data with the same exception. See the "Erase Suspend/Erase
Resume Commands" section section for more information.
The system must issue the reset command to return a bank to the read (or erase-
suspend-read) mode if DQ5 goes high during an active program or erase opera-
tion, or if the bank is in the autoselect mode. See the next section, "Reset
Command" section, for more information.
erations" section section for more information. The "Read-Only Operations"
section table provides the read parameters, and 14 shows the timing diagram.
Reset Command
Writing the reset command resets the banks to the read or erase-suspend-read
mode. Address bits are don’t cares for this command.
The reset command may be written between the sequence cycles in an erase
command sequence before erasing begins. This resets the bank to which the sys-
tem was writing to the read mode. Once erasure begins, however, the device
ignores reset commands until the operation is complete.
The reset command may be written between the sequence cycles in a program
command sequence before programming begins. This resets the bank to which
the system was writing to the read mode. If the program command sequence is
written to a bank that is in the Erase Suspend mode, writing the reset command
returns that bank to the erase-suspend-read mode. Once programming begins,
however, the device ignores reset commands until the operation is complete.
The reset command may be written between the sequence cycles in an autoselect
command sequence. Once in the autoselect mode, the reset command must be
written to return to the read mode. If a bank entered the autoselect mode while
in the Erase Suspend mode, writing the reset command returns that bank to the
erase-suspend-read mode.
相關(guān)PDF資料
PDF描述
S71WS512NC0BAWEK2 Stacked Multi-Chip Product (MCP)
S71WS512NC0BAWEK3 Stacked Multi-Chip Product (MCP)
S71WS512NC0BAWEN0 Stacked Multi-Chip Product (MCP)
S71WS512NC0BAWEN2 Stacked Multi-Chip Product (MCP)
S71WS512NC0BAWEN3 Stacked Multi-Chip Product (MCP)
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
S71KL512SC0BHV000 功能描述:IC 512MB FLASH 64MB DRAM 24FBGA 制造商:cypress semiconductor corp 系列:HyperFlash? + HyperRAM? KL 包裝:托盤 零件狀態(tài):在售 格式 - 存儲器:多芯(FLASH/RAM) 存儲器類型:FLASH + DRAM 存儲容量:512Mbit Flash, 64Mbit RAM 速度:100MHz 接口:并聯(lián),串行 電壓 - 電源:2.7 V ~ 3.6 V 工作溫度:-40°C ~ 105°C(TA) 封裝/外殼:24-VBGA 供應(yīng)商器件封裝:24-FBGA(6x8) 標(biāo)準(zhǔn)包裝:338
S71NS032J80 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Product (MCP)
S71NS032J80BJWRA 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Product (MCP)
S71NS032JA0 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Product (MCP)
S71NS032JA0BJWRT 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Product (MCP)