參數(shù)資料
型號: S71JL064H80BAI020
廠商: ADVANCED MICRO DEVICES INC
元件分類: 存儲器
英文描述: SPECIALTY MEMORY CIRCUIT, PBGA73
封裝: 11.60 X 8 MM, FBGA-73
文件頁數(shù): 34/95頁
文件大小: 2244K
代理商: S71JL064H80BAI020
4
S71JLxxxHxx_00A0 February 24, 2004
Adva nce
Inform at i o n
VCC Supply Voltages ......................................................................................73
Figure 10. ICC1 Current vs. Time (Showing Active and Automatic
Sleep Currents).................................................................. 75
Figure 22. Data# Polling Timings (During Embedded Algorithms) .
83
Alternate CE# Controlled Erase and Program Operations ................. 86
Figure 27. Alternate CE# Controlled Write (Erase/Program)
Operation Timings .............................................................. 87
Capacitance (f=1MHz, TA=25°C) ...................................................................90
Read/Write Charcteristics (VCC=2.7-3.3V) ................................................ 92
CD#1=OE#=VIL, CS2=WE#=VIH, UB# and/or LB#=VIL)........ 93
is low, ignore UB#/LB# timing) ........................................... 93
Capacitance (f=1MHz, TA=25°C) ...................................................................97
Read/Write Charcteristics (VCC=2.7-3.3V) ................................................98
CD#1=OE#=VIL, CS2=WE#=VIH, UB# and/or LB#=VIL)........ 99
= VIH)............................................................................ 107
相關PDF資料
PDF描述
S71WS512NC0BAWEK2 Stacked Multi-Chip Product (MCP)
S71WS512NC0BAWEK3 Stacked Multi-Chip Product (MCP)
S71WS512NC0BAWEN0 Stacked Multi-Chip Product (MCP)
S71WS512NC0BAWEN2 Stacked Multi-Chip Product (MCP)
S71WS512NC0BAWEN3 Stacked Multi-Chip Product (MCP)
相關代理商/技術參數(shù)
參數(shù)描述
S71KL512SC0BHV000 功能描述:IC 512MB FLASH 64MB DRAM 24FBGA 制造商:cypress semiconductor corp 系列:HyperFlash? + HyperRAM? KL 包裝:托盤 零件狀態(tài):在售 格式 - 存儲器:多芯(FLASH/RAM) 存儲器類型:FLASH + DRAM 存儲容量:512Mbit Flash, 64Mbit RAM 速度:100MHz 接口:并聯(lián),串行 電壓 - 電源:2.7 V ~ 3.6 V 工作溫度:-40°C ~ 105°C(TA) 封裝/外殼:24-VBGA 供應商器件封裝:24-FBGA(6x8) 標準包裝:338
S71NS032J80 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Product (MCP)
S71NS032J80BJWRA 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Product (MCP)
S71NS032JA0 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Product (MCP)
S71NS032JA0BJWRT 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Product (MCP)