TM Family Datasheet Page 5 of 77 August 2009 – Rev" />
參數(shù)資料
型號: PI7C9X20303ULAZPE
廠商: Pericom
文件頁數(shù): 45/77頁
文件大小: 0K
描述: IC PCIE PACKET SWITCH 132TQFN
標(biāo)準(zhǔn)包裝: 168
系列: UltraLo™
應(yīng)用: 封裝開關(guān),3 端口/3 線道
接口: PCI Express
封裝/外殼: 132-VFQFN 雙排裸露焊盤
供應(yīng)商設(shè)備封裝: 132-TQFN-EP(10x10)
包裝: 托盤
安裝類型: 表面貼裝
PI7C9X20303UL
3Port-3Lane PCI Express Switch
UltraLo
TM Family
Datasheet
Page 5 of 77
August 2009 – Revision 1.1
Pericom Semiconductor
TABLE OF CONTENTS
1
FEATURES.........................................................................................................................................................10
2
GENERAL DESCRIPTION..............................................................................................................................11
3
PIN DESCRIPTION...........................................................................................................................................12
3.1
PCI EXPRESS INTERFACE SIGNALS ....................................................................................................12
3.2
PORT CONFIGURATION SIGNALS .......................................................................................................12
3.3
MISCELLANEOUS SIGNALS..................................................................................................................12
3.4
JTAG BOUNDARY SCAN SIGNALS ......................................................................................................13
3.5
POWER PINS.............................................................................................................................................14
4
PIN ASSIGNMENTS .........................................................................................................................................15
4.1
PIN LIST OF 132-PIN TQFN ......................................................................................................................15
5
FUNCTIONAL DESCRIPTION.......................................................................................................................16
5.1
PHYSICAL LAYER CIRCUIT ..................................................................................................................16
5.2
DATA LINK LAYER (DLL)......................................................................................................................18
5.3
TRANSACTION LAYER RECEIVE BLOCK (TLP DECAPSULATION) ..............................................18
5.4
ROUTING ..................................................................................................................................................18
5.5
TC/VC MAPPING......................................................................................................................................19
5.6
QUEUE.......................................................................................................................................................19
5.6.1
PH ....................................................................................................................................................... 19
5.6.2
PD ....................................................................................................................................................... 19
5.6.3
NPHD ................................................................................................................................................. 19
5.6.4
CPLH .................................................................................................................................................. 19
5.6.5
CPLD .................................................................................................................................................. 19
5.7
TRANSACTION ORDERING...................................................................................................................20
5.8
PORT ARBITRATION ..............................................................................................................................20
5.9
FLOW CONTROL .....................................................................................................................................21
5.10
TRANSATION LAYER TRANSMIT BLOCK (TLP ENCAPSULATION) .............................................21
6
EEPROM INTERFACE AND SYSTEM MANAGEMENT BUS..................................................................22
6.1
EEPROM INTERFACE .............................................................................................................................22
6.1.1
AUTO MODE EERPOM ACCESS ..................................................................................................... 22
6.1.2
EEPROM MODE AT RESET .............................................................................................................. 22
6.1.3
EEPROM SPACE ADDRESS MAP .................................................................................................... 22
6.1.4
MAPPING EEPROM CONTENTS TO CONFIGURATION REGISTERS.......................................... 24
6.2
SMBUS INTERFACE .................................................................................................................................29
7
REGISTER DESCRIPTION .............................................................................................................................30
7.1
REGISTER TYPES ....................................................................................................................................30
7.2
TRANSPARENT MODE CONFIGURATION REGISTERS....................................................................30
7.2.1
VENDOR ID REGISTER – OFFSET 00h ........................................................................................... 32
7.2.2
DEVICE ID REGISTER – OFFSET 00h............................................................................................. 32
7.2.3
COMMAND REGISTER – OFFSET 04h ............................................................................................ 32
7.2.4
PRIMARY STATUS REGISTER – OFFSET 04h................................................................................. 33
7.2.5
REVISION ID REGISTER – OFFSET 08h ......................................................................................... 33
7.2.6
CLASS CODE REGISTER – OFFSET 08h ......................................................................................... 33
7.2.7
CACHE LINE REGISTER – OFFSET 0Ch......................................................................................... 34
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PI7C9X20303ULAZPEX 功能描述:外圍驅(qū)動器與原件 - PCI 3port 3lane PCIe Packet Switch RoHS:否 制造商:PLX Technology 工作電源電壓: 最大工作溫度: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FCBGA-1156 封裝:Tray
PI7C9X20404GPANBE 制造商:Pericom Semiconductor Corporation 功能描述:4PORT 4LANE PCIE PACKETSWITCH - Trays
PI7C9X20404GPBNBE 功能描述:外圍驅(qū)動器與原件 - PCI 4port 4lane PCIe PacketSwitch RoHS:否 制造商:PLX Technology 工作電源電壓: 最大工作溫度: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FCBGA-1156 封裝:Tray
PI7C9X20404SLCEVB 制造商:Pericom Semiconductor Corporation 功能描述:PCIE 4 PORT SWITCH EVAL BOARD - Boxed Product (Development Kits)
PI7C9X20404SLCFDE 功能描述:外圍驅(qū)動器與原件 - PCI 4port 4lane PCIe Packet Switch RoHS:否 制造商:PLX Technology 工作電源電壓: 最大工作溫度: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FCBGA-1156 封裝:Tray