參數(shù)資料
型號： pentium II
廠商： Intel Corp.
英文描述： pentium II processor With On-die Cache Mobile Module Connector 1 (MMC-1)(帶緩存和連接器1的奔II處理器)
中文描述： 奔騰II處理器芯片上緩存手機模塊連接器1（MMC管理- 1）（帶緩存和連接器1的奔二處理器）
文件頁數(shù)： 3/34頁
文件大小： 582K
代理商： PENTIUM II
3
Intel
a
Pentium
a
II Processor With On-die Cache Mobile Module MMC-1
CONTENTS
1.0
1.1
2.0
3.0
3.1
3.1.1
3.1.2
3.1.3.
3.1.4
INTRODUCTION ..................................................5
Revision History....................................................5
ARCHITECTURE OVERVIEW.............................5
MODULE CONNECTOR INTERFACE ................7
Signal Definition....................................................7
Signal List................................................8
Memory (108 Signals).............................9
PCI (56 Signals)....................................10
Processor and PIIX4E/M Sideband
(9 Signals)............................................11
Power Management (8 Signals)...........12
Clock (8 Signals)...................................13
Voltages (39 Signals)............................14
JTAG (7 Signals)...................................14
Miscellaneous (45 Signals)...................15
Connector Pin Assignments...............................16
Pin and Pad Assignments...................................18
FUNCTIONAL DESCRIPTION...........................19
Pentium II Processor With On-Die Cache Mobile
Module MMC-1......................................................19
L2 Cache.............................................................19
The 82443DX Host Bridge System Controller ...19
Memory Organization............................19
Reset Strap Options..............................20
PCI Interface..........................................20
AGP Feature Set...................................20
Power Management............................................20
Clock Control Architecture....................20
Normal State..........................................22
Auto Halt State......................................22
Stop Grant State....................................22
Quick Start State...................................22
HALT/Grant Snoop State......................22
Sleep State............................................22
Deep Sleep State..................................23
3.1.5
3.1.6
3.1.7
3.1.8
3.1.9
3.2
3.3
4.0
4.1
4.2
4.3
4.3.1
4.3.2
4.3.3
4.3.4
4.4
4.4.1
4.4.2
4.4.3
4.4.4
4.4.5
4.4.6
4.4.7
4.4.8
4.5
4.6
4.6.1
4.6.2
Typical POS/STR Power...................... 23
Electrical Requirements..................................... 24
DC Requirements................................. 24
AC Requirements................................. 25
4.6.2.1
BCLK Signal Quality Specifications and
Measurement Guidelines ..................... 26
The Voltage Regulator ....................................... 26
4.7.1
Voltage Regulator Efficiency................ 26
4.7.2.
Control of the Voltage Regulator.......... 27
4.7.2.1
Voltage Signal Definition and
Sequencing........................................... 28
4.7.3
Power Planes: Bulk Capacitance Requirements 29
4.7.4
Surge Current Guidelines..................... 30
4.7.4.1
Slew-rate Control: Circuit Description.. 32
4.7.4.2
Undervoltage Lockout: Circuit
Description (V_uv_lockout).................. 33
4.7.4.3
Overvoltage Lockout: Circuit Description
(V_ov_lockout)...................................... 34
4.7.4.4
Overcurrent Protection: Circuit
Description............................................ 34
4.8
Active Thermal Feedback .................................. 34
4.9
Thermal Sensor Configuration Register............ 35
5.0
MECHANICAL SPECIFICATION....................... 35
5.1
Module Dimensions............................................ 35
5.1.1
MMC-1 Connector Pin 1 Location........ 36
5.1.2
Printed Circuit Board Thickness........... 36
5.1.3
Height Restrictions ............................... 37
5.2
Thermal Transfer Plate....................................... 38
5.3
Physical Support................................................. 39
5.3.1
Mounting Requirements....................... 39
5.3.2
Module Weight...................................... 40
6.0
THERMAL SPECIFICATION............................. 40
6.1
Thermal Design Power....................................... 40
6.2
Thermal Sensor Setpoint ................................... 40
7.0
LABELING INFORMATION............................... 41
8.0
ENVIRONMENTAL STANDARDS..................... 42
4.7
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