參數(shù)資料
型號(hào): NCP5322A
廠商: ON SEMICONDUCTOR
英文描述: TWO-PHASE BUCK CONTROLLER WITH INTEGRATED GATE DRIVERS AND 5-BIT DAC
中文描述: 兩相降壓控制器,它集成柵極驅(qū)動(dòng)器和5位DAC
文件頁數(shù): 17/32頁
文件大?。?/td> 1091K
代理商: NCP5322A
NCP5322A
http://onsemi.com
17
3. Place the components associated with the internal
error amplifier (R
FBK1
, C
FBK2
, C
AMP
, R
CMP1
,
C
CMP1
, R
DRP1
) to minimize the trace lengths to
the pins V
FB
, V
DRP
and COMP.
4. Place the current sense components (R
CS1
, R
CS2
,
C
CS1
, C
CS2
, R
CSREF
, C
CSREF
) near the CS1, CS2,
and CS
REF
pins.
5. Place the frequency setting resistor (R
OSC
) close to
the R
OSC
pin. The R
OSC
pin is very sensitive to
noise. Route noisy traces, such as the SWNODEs
and GATE traces, away from the R
OSC
pin and
resistor.
6. Place the Soft Start capacitor (C
SS
) near the Soft
Start pin.
7. Place the MOSFETs and output inductors to reduce
the size of the noisy SWNODEs. There is a trade
off between reducing the size of the SWNODEs
for noise reduction and providing adequate
heat
sinking for the synchronous MOSFETs.
8. Place the input inductor and input capacitor(s) near
the Drain of the control (upper) MOSFETs. There
is a trade
off between reducing the size of this
node to save board area and providing adequate
heat
sinking for the control MOSFETs.
9. Place the output capacitors (electrolytic and ceramic)
close to the processor socket or output connector.
10. The trace from the SWNODEs to the current sense
components (R
CS1
, R
CS2
) will be very noisy.
Route this away from more sensitive, low
level
traces. The Ground layer can be used to help
isolate this trace.
11. The Gate traces are very noisy. Route these away
from more sensitive, low
level traces. Keep each
Gate signal on one layer and insure that there is an
uninterrupted return path directly below the Gate
trace. The Ground layer can be used to help isolate
these traces.
12. Don
t
daisy chain
connections to Ground from
one via. Allow each connection to Ground to have
its own via as close to the component as possible.
13. Use a slot in the ground plane from the bulk output
capacitors back to the input power connector to
prevent high currents from flowing beneath the
control IC. This slot should extend length
wise
under the control IC and separate the connections
to
signal ground
and
power ground.
Examples
of signal ground include the capacitors at COMP,
CS
REF
, Soft
Start (SS), V
CCL
, and REF, the
resistors at R
OSC
and I
LIM
, and the LGND pin to
the controller. Examples of power ground include
the capacitors to V
CCH1
(and/or V
CCH2
) and
V
CCL1
(and/or V
CCL2
), the Source of the
synchronous MOSFET, and the GND1 and GND2
pins of the controller.
14. The CS
REF
sense point should be equidistant
between the output inductors to equalize the PCB
resistance added to the current sense paths. This
will insure acceptable current sharing. Also, route
the CS
REF
connection away from noisy traces such
as the SWNODEs and GATE traces. If noise from
the SWNODEs or GATE signals capacitively
couples to the CS
REF
trace the external ramps will
be very noisy and voltage jitter will result.
15. Ideally, the SWNODEs are exactly the same shape
and the current sense points (connections to R
CS1
and R
CS2
) are made at identical locations to
equalize the PCB resistance added to the current
sense paths. This will help to insure acceptable
current sharing.
16. Place the 0.1
μ
F ceramic capacitors, C
Q1
and C
Q2
,
close to the drains of the MOSFETs Q1 and Q2,
respectively.
Design Procedure
1. Output Capacitor Selection
The output capacitors filter the current from the output
inductor and provide a low impedance for transient load
current changes. Typically, microprocessor applications
will require both bulk (electrolytic, tantalum) and low
impedance, high frequency (ceramic) types of capacitors.
The bulk capacitors provide
hold up
during transient
loading. The low impedance capacitors reduce steady
state
ripple and bypass the bulk capacitance when the output
current changes very quickly. The microprocessor
manufacturers usually specify a minimum number of
ceramic capacitors. The designer must determine the
number of bulk capacitors.
Choose the number of bulk output capacitors to meet the
peak transient requirements. The formula below can be used
to provide a starting point for the minimum number of bulk
capacitors (N
OUT,MIN
):
NOUT,MIN
ESR per capacitor
IO,MAX
VO,MAX
(1)
In reality, both the ESR and ESL of the bulk capacitors
determine the voltage change during a load transient
according to:
VO,MAX
( IO,MAX
t)
ESL
IO,MAX
ESR
(2)
Unfortunately, capacitor manufacturers do not specify the
ESL of their components and the inductance added by the
PCB traces is highly dependent on the layout and routing.
Therefore, it is necessary to start a design with slightly more
than the minimum number of bulk capacitors and perform
transient testing or careful modeling/simulation to
determine the final number of bulk capacitors.
2. Output Inductor Selection
The output inductor may be the most critical component
in the converter because it will directly effect the choice of
other components and dictate both the steady
state and
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