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參數(shù)資料
| 型號： | NAND99W3M1AZBC5F |
| 廠商： | NUMONYX |
| 元件分類： | 存儲器 |
| 英文描述： | SPECIALTY MEMORY CIRCUIT, PBGA137 |
| 封裝： | 10.50 X 13 MM, 1.20 MM HEIGHT, 0.80 MM PITCH, ROHS COMPLIANT, TFBGA-137 |
| 文件頁數(shù)： | 18/33頁 |
| 文件大?。?/td> | 724K |
| 代理商： | NAND99W3M1AZBC5F |
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NANDxxxxMx
Package mechanical
25/32
5
Package mechanical
To meet environmental requirements, Numonyx offers the devices in ECOPACK packages,
which are lead-free. In compliance with JEDEC Standard JESD97, the category of second-
level interconnect is marked on the package and on the inner box label. The maximum
ratings related to soldering conditions are also marked on the inner box label.
Figure 9.
TFBGA107 10.5 × 13 x 1.2 mm - 10 × 14 active ball array, 0.80 mm pitch,
package outline
1.
Drawing is not to scale.
A2
A1
A
BGA-Z24
ddd
D
E
e
b
SE
FD
FE
E1
e
SD
D1
BALL "B1"
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| NANDA8R3N0AZBB5E | 制造商:Micron Technology Inc 功能描述:WIRELESS - Trays |
| NANDA8R3N1AZBC5E | 制造商:Micron Technology Inc 功能描述:WIRELESS - Trays |
| NANDA8R3N1AZBC5F | 制造商:Micron Technology Inc 功能描述:WIRELESS - Tape and Reel |
| NANDA8R3N8AZBB5E | 制造商:Micron Technology Inc 功能描述:128MX8/16MX16 MCP PLASTIC WIRELESS TEMP PBF TFBGA 1.8V - Trays |
| NANDA8R3N8AZBB5F | 制造商:Micron Technology Inc 功能描述:128MX8/16MX16 MCP PLASTIC WIRELESS TEMP PBF TFBGA 1.8V - Tape and Reel |
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