參數(shù)資料
型號(hào): MT55L64L32F1
廠商: Micron Technology, Inc.
英文描述: 64K x 32,3.3V I/O, ZBT SRAM(2Mb,3.3V輸入/輸出,靜態(tài)RAM)
中文描述: 64K的x 32,3.3六/ O的ZBT SRAM的(處理器,3.3V的輸入/輸出,靜態(tài)內(nèi)存)
文件頁(yè)數(shù): 10/23頁(yè)
文件大小: 406K
代理商: MT55L64L32F1
10
2Mb: 128K x 18, 64K x 32/36 3.3V I/O, Flow-Through ZBT SRAM
MT55L128L18F1_2.p65
Rev. 8/00
Micron Technology, Inc., reserves the right to change products or specifications without notice.
2000, Micron Technology, Inc.
2Mb: 128K x 18, 64K x 32/36
3.3V I/O, FLOW-THROUGH ZBT SRAM
FBGA PIN DESCRIPTIONS (continued)
x18
x32/x36
SYMBOL
V
SS
TYPE
Supply Ground:
GND.
DESCRIPTION
1H, 4C, 4N, 5C, 1H, 4C, 4N, 5C,
5D, 5E 5F,
5G, 5H, 5J,
5K, 5L, 5M,
6C,
6D,
6E,
6F, 6C,
6D,
6E,
6F,
6G, 6H, 6J,
6K, 6L, 6M,
7C, 7D, 7E,
7F, 7G, 7H,
7J, 7K, 7L,
7M, 7N, 8C, 8N 7M, 7N, 8C, 8N
5P, 5R, 7P, 7R 5P, 5R, 7P, 7R
5D, 5E 5F,
5G, 5H, 5J,
5K, 5L, 5M,
6G, 6H, 6J,
6K, 6L, 6M,
7C, 7D, 7E,
7F, 7G, 7H,
7J, 7K, 7L,
DNU
Do Not Use: These signals may either be unconnected or wired to
GND to improve package heat dissipation.
No Connect: These signals are not internally connected and
may be connected to ground to improve package heat
dissipation.
1A, 1B, 1C,
1D, 1E, 1F,
1G, 1P, 2C,
2J, 2K, 2L,
2M, 2N, 2P,
2R, 3H, 4B,
5A, 5N, 6N,
9A, 9B, 9H,
10C, 10D, 10E,
10F, 10G,
10H, 10N,
11B, 11J,
11K, 11L,
11M, 11N,
11P, 11R
1A, 1B, 1P,
2C, 2N, 2P,
2R, 3H, 5N,
6N, 9A, 9B,
9H, 10C,
10H, 10N,
11A, 11B,
11P, 11R
NC
NOTE:
Pins 11R, 9A, and 9B are reserved for address expansion; 4Mb, 8Mb, and 16Mb respectively.
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