
50
64Mb: x32 DDR SDRAM
2M32DDR-07.p65 
–
 Rev. 12/01
 Micron Technology, Inc., reserves the right to change products or specifications without notice.
2001, Micron Technology, Inc.
64Mb: x32
DDR SDRAM
NOTES (continued)
37. Reduced Output Drive Curves:
a)The full variation in driver pull-down current
from minimum to maximum process, tempera-
ture and voltage will lie within the outer
bounding lines of the V-I curve of Figures E and F.
b)The variation in driver pull-down current
within nominal limits of voltage and tempera-
ture is expected, but not guaranteed, to lie
within the inner bounding lines of the V-I
curve of Figures E and F.
c) The full variation in driver pull-up current from
minimum to maximum process, temperature
and voltage will lie within the outer bounding
lines of the V-I curve of Figures G and H.
d)The variation in driver pull-up current within
nominal limits of voltage and temperature is
expected, but not guaranteed, to lie within
the inner bounding lines of the V-I curve of
Figures G and H.
e)The full variation in the ratio of the maximum
to minimum pull-up and pull-down current
will not exceed 1.7, for device drain-to-source
voltages from 0 to V
DD
Q/2.
f) The full variation in the ratio of the nominal
pull-up to pull-down current should be unity
±10%, for device drain-to-source voltages from
0 to 0.1V to 1.0V.
38. The voltage levels used are derived from the
referenced test load. In practice, the voltage
levels obtained from a properly terminated bus
will provide significantly different voltage values.
39.  V
IH
  overshoot: VIH (MAX)  = V
DD
Q+1.5V for a pulse
width 
≤
 3ns and the pulse width can not be
greater than 1/3 of the cycle rate. V
IL
 undershoot:
V
IL
 (MIN) = -1.5V for a pulse width 
≤
  3ns and the
pulse width can not be greater than 1/3 of the
cycle rate.
40. CKE must be active (high) during the entire time
a refresh command is executed.  That is, from the
time the AUTO REFRESH command is registered,
CKE must be active at each rising clock edge,
until
 t
REF later.
41. Whenever the operating frequency is altered, not
including jitter, the DLL is required to be reset
and followed by a 200 clock cycle delay.
42. V
DD
 and V
DD
Q must track each other.
43. Will slightly adjust with V
DD
/V
DD
Q level.
44. During initialization, V
DD
Q, V
TT,
 and V
REF
 must be
equal to or less than V
DD
 + 0.3V.  Alternatively, V
TT
may be 1.35V maximum during power up, even if
V
DD
/V
DD
Q are 0 volts, provided a minimum of 42
ohms or series resistance is used between the V
TT
supply and the input pin.
45. 
t
RCD 
≤
t
RAP
Figure E
Pull-Down Characteristics
80
I
O
V
OUT
 (V)
Nominal low
Minimum
Nominal high
Maximum
70
60
50
40
30
20
10
0
0.0
0.5
1.0
1.5
2.0
2.5
Figure G
Pull-Up Characteristics
0
I
O
Nominal low
Minimum
Nominal high
Maximum
-20
-40
-60
-80
-100
-120
0.0
0.5
1.0
1.5
2.0
2.5
V
DD
Q - V
OUT (V)
Figure F
Pull-Down Characteristics
I
O
V
OUT
 (V)
Nominal low
Minimum
Nominal high
Maximum
50
40
30
20
10
0
0.0
0.2
0.1
0.3
0.4
0.5
0.7
0.6
0.8
0.9
1.0