參數(shù)資料
型號(hào)： MSC8103VT1200F
廠商： Freescale Semiconductor
文件頁(yè)數(shù)： 42/104頁(yè)
文件大?。?/td> 0K
描述： IC DSP 16BIT 300MHZ 332-FCPBGA
標(biāo)準(zhǔn)包裝： 90
系列： StarCore
類型： SC140 內(nèi)核
接口： 通信處理器模塊（CPM）
時(shí)鐘速率： 300MHz
非易失內(nèi)存： 外部
芯片上RAM： 512kB
電壓 - 輸入/輸出： 3.30V
電壓 - 核心： 1.60V
工作溫度： -40°C ~ 75°C
安裝類型： 表面貼裝
封裝/外殼： 332-BFBGA，F(xiàn)CPBGA
供應(yīng)商設(shè)備封裝： 332-FCBGA（17x17）
包裝： 托盤
MSC8103 Network Digital Signal Processor, Rev. 12
2-2
Freescale Semiconductor
Physical and Electrical Specifications
2.2 Recommended Operating Conditions
Table 2-2 lists recommended operating conditions. Proper device operation outside of these conditions is not
guaranteed.
Table 2-3 describes thermal characteristics of the MSC8103.
See Section 4.1, Thermal Design Considerations, on page 4-1 for details on these characteristics.
Table 2-2.
Recommended Operating Conditions
Rating
Symbol
Value
Unit
SC140 core supply voltage
VDD
275 MHz: 1.5 to 1.7
300 MHz: 1.55 to 1.7
V
PLL supply voltage
VCCSYN
275 MHz: 1.5 to 1.7
300 MHz: 1.55 to 1.7
V
I/O supply voltage
VDDH
3.135 to 3.465
V
Input voltage
VIN
–0.2 to VDDH + 0.2
V
Operating temperature range
TJ
275 MHz: –40 to 105
300 MHz: –40 to 75
°C
Table 2-3.
Thermal Characteristics
Characteristic
Symbol
Lidded FC-PBGA
17
× 17 mm
Unit
Natural Convection
200 ft/min
(1 m/s) airflow
Junction-to-ambient, single-layer board1, 2
RθJA or θJA
50
37
°C/W
Junction-to-ambient, four-layer board1, 3
RθJA or θJA
22
18
°C/W
Junction-to-board3
RθJB or θJB
15
°C/W
Junction-to-case4
RθJC or θJC
0.8
°C/W
Notes:
1.
Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting site (board)
temperature, ambient temperature, air flow, power dissipation of other components on the board, and board thermal
resistance.
2.
Per SEMI G38-87 and EIA/JESD51-2 with the single layer board horizontal.
3.
Per JEDEC JESD51-6 with the board (JESD51-9) horizontal.
4.
Thermal resistance between the die and the printed circuit board per JEDEC JESD 51-8. Board temperature is measured on
the top surface of the board near the package.
5.
Thermal resistance between the die and the case top surface without thermal grease. TBD = to be determined. If a thin (less
than 50 micron) thermal grease interface is established to a heat sink from the lid, the junction to sink thermal resistance is
about 0.7 °C/W.
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