![](http://datasheet.mmic.net.cn/280000/MPC970_datasheet_16098379/MPC970_15.png)
MPC970
TIMING SOLUTIONS
BR1333 — Rev 6
15
MOTOROLA
OUTLINE DIMENSIONS
FA SUFFIX
TQFP PACKAGE
CASE 848D–03
ISSUE C
F
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DATUM PLANE –H– IS LOCATED AT BOTTOM OF
LEAD AND IS COINCIDENT WITH THE LEAD
WHERE THE LEAD EXITS THE PLASTIC BODY AT
THE BOTTOM OF THE PARTING LINE.
4. DATUMS –L–, –M– AND –N– TO BE DETERMINED
AT DATUM PLANE –H–.
5. DIMENSIONS S AND V TO BE DETERMINED AT
SEATING PLANE –T–.
6. DIMENSIONS A AND B DO NOT INCLUDE MOLD
PROTRUSION. ALLOWABLE PROTRUSION IS
0.25 (0.010) PER SIDE. DIMENSIONS A AND B DO
INCLUDE MOLD MISMATCH AND ARE
DETERMINED AT DATUM PLANE -H-.
7. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. DAMBAR PROTRUSION SHALL
NOT CAUSE THE LEAD WIDTH TO EXCEED 0.46
(0.018). MINIMUM SPACE BETWEEN
PROTRUSION AND ADJACENT LEAD OR
PROTRUSION 0.07 (0.003).
éééé
éééé
D
VIEW AA
VIEW AA
2 X R
R1
AB
AB
VIEW Y
SECTION AB–AB
ROTATED 90 CLOCKWISE
DIM
A
A1
B
B1
C
C1
C2
D
E
F
G
J
K
R1
S
S1
U
V
V1
W
Z
θ
MIN
10.00 BSC
5.00 BSC
10.00 BSC
5.00 BSC
–––
0.05
1.30
0.20
0.45
0.22
0.65 BSC
0.07
0.50 REF
0.08
12.00 BSC
6.00 BSC
0.09
12.00 BSC
6.00 BSC
0.20 REF
1.00 REF
0
0
MAX
MIN
0.394 BSC
0.197 BSC
0.394 BSC
0.197 BSC
–––
0.002
0.051
0.008
0.018
MAX
INCHES
MILLIMETERS
1.70
0.20
1.50
0.40
0.75
0.067
0.008
0.059
0.016
0.030
0.014
0.35
0.009
0.026 BSC
0.003
0.020 REF
0.003
0.472 BSC
0.236 BSC
0.004
0.472 BSC
0.236 BSC
0.008 REF
0.039 REF
0
0
12
5
0.20
0.008
0.20
0.008
0.16
0.006
C
–X–
X=L, M, N
1
13
14
26
27
39
40
52
4X TIPS
4X
N
0.20 (0.008) H L–M
N
0.20 (0.008) T L–M
3X
VIEW Y
SEATING
C
0.10 (0.004) T
4X
θ
3
4X
θ
2
S
0.05 (0.002)
0.25 (0.010)
GAGE PLANE
C2
C1
W
K
E
Z
S
L–M
M
0.13 (0.005)
N
S
T
PLATING
BASE METAL
J
U
B
V
B1
A
S
V1
A1
S1
–L–
–N–
–M–
–H–
–T–
θ
1
θ
G
θ
1
θ
2
θ
3
7
–––
12
5
13
7
–––
REF
REF
13