參數(shù)資料
型號： MPC8240RZU266X
廠商： MOTOROLA INC
元件分類： 微控制器/微處理器
英文描述： 32-BIT, 266 MHz, RISC PROCESSOR, PBGA352
封裝： 35 X 35 MM, 1.65 MM HEIGHT, 1.27 MM PITCH, CAVITY DOWN, TBGA-352
文件頁數(shù)： 40/48頁
文件大?。?/td> 279K
代理商： MPC8240RZU266X
MOTOROLA
MPC8240 Hardware Specifications
45
PRELIMINARY (Rev 0.2) SUBJECT TO CHANGE WITHOUT NOTICE
Chomerics, Inc.
781-935-4850
77 Dragon Court
Woburn, MA 01888-4014
Internet: www.chomerics.com
Thermagon Inc.
888-246-9050
3256 West 25th Street
Cleveland, OH 44109-1668
Internet: www.thermagon.com
Loctite Corporation
860-571-5100
1001 Trout Brook Crossing
Rocky Hill, CT 06067-3910
Internet: www.loctite.com
The following section provides a heat sink selection example using one of the commercially available heat
sinks.
1.7.7.3 Heat Sink Selection Example
For preliminary heat sink sizing, the die-junction temperature can be expressed as follows:
TJ = TA + TR + (qJC + qINT + qSA) * PD
Where:
TJ is the die-junction temperature
TA is the inlet cabinet ambient temperature
TR is the air temperature rise within the computer cabinet
q
JC is the junction-to-case thermal resistance
q
INT is the adhesive or interface material thermal resistance
q
SA is the heat sink base-to-ambient thermal resistance
PD is the power dissipated by the device
During operation the die-junction temperatures (TJ) should be maintained less than the value specied in
Table 2. The temperature of the air cooling the component greatly depends upon the ambient inlet air
temperature and the air temperature rise within the electronic cabinet. An electronic cabinet inlet-air
temperature (TA) may range from 30 to 40 C. The air temperature rise within a cabinet (TR) may be in the
range of 5 to 10 C. The thermal resistance of the thermal interface material (
q
INT) is typically about 1 C/
W. Assuming a TA of 30 C, a TR of 5 C, a TBGA package qJC = 1.8, and a power consumption (PD) of 5.0
watts, the following expression for TJ is obtained:
Die-junction temperature: TJ = 30 C + 5 C + (1.8 C/W + 1.0 C/W + qSA) * 5.0 W
For preliminary heat sink sizing, the heat sink base-to-ambient thermal resistance is needed from the heat
sink manufacturer.
Though the die junction-to-ambient and the heat sink-to-ambient thermal resistances are a common gure-
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