參數(shù)資料
型號： MPC7410VS500LE
廠商： Freescale Semiconductor
文件頁數(shù)： 37/56頁
文件大?。?/td> 0K
描述： IC MPU PPC 500MHZ 360-FCCLGA
標(biāo)準(zhǔn)包裝： 44
系列： MPC74xx
處理器類型： 32-位 MPC74xx PowerPC
速度： 500MHz
電壓： 1.8V
安裝類型： 表面貼裝
封裝/外殼： 360-CLGA，F(xiàn)CCLGA
供應(yīng)商設(shè)備封裝： 360-FCCLGA（25x25）
包裝： 托盤
MPC7410 RISC Microprocessor Hardware Specifications, Rev. 6.1
42
Freescale Semiconductor
System Design Information
The COP interface has a standard header for connection to the target system, based on the 0.025" square-post 0.100"
centered header assembly (often called a Berg header). The connector typically has pin 14 removed as a connector
key.
There is no standardized way to number the COP header shown in Figure 25; consequently, many different pin
numbers have been observed from emulator vendors. Some are numbered top-to-bottom then left-to-right, while
others use left-to-right then top-to-bottom, while still others number the pins counter clockwise from pin 1 (as with
an IC). Regardless of the numbering, the signal placement recommended in Figure 25 is common to all known
emulators.
The QACK signal shown in Figure 25 is usually connected to the PCI bridge chip in a system and is an input to the
MPC7410 informing it that it can go into the quiescent state. Under normal operation this occurs during a low-power
mode selection. In order for COP to work, the MPC7410 must see this signal asserted (pulled down). While shown
on the COP header, not all emulator products drive this signal. If the product does not, a pull-down resistor can be
populated to assert this signal. Additionally, some emulator products implement open-drain type outputs and can
only drive QACK asserted; for these tools, a pull-up resistor can be implemented to ensure this signal is negated
when it is not being driven by the tool. Note that the pull-up and pull-down resistors on the QACK signal are
mutually exclusive and it is never necessary to populate both in a system. To preserve correct power-down operation,
QACK should be merged via logic so that it also can be driven by the PCI bridge.
8.8 Thermal Management Information
This section provides thermal management information for the MPC7410 for air-cooled applications. Proper
thermal control design is primarily dependent on the system-level design—the heat sink, airflow, and thermal
interface material. To reduce the die-junction temperature, heat sinks may be attached to the package by several
methods such as spring clip to holes in the printed circuit board or with screws and springs to the printed circuit
board; see Figure 26 for the BGA package and Figure 27 for the LGA package. This spring force should not exceed
5.5 pounds of force. Note that care should be taken to avoid focused forces being applied to die corners and/or edges
when mounting heat sinks.
Figure 26. BGA Package Exploded Cross-Sectional View with Heat Sink Clip to PCB Option
Thermal Interface Material
Heat Sink
BGA Package
Heat Sink
Clip
Printed-Circuit Board
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