參數(shù)資料
型號： MC56F8355VFG60
廠商： MOTOROLA INC
元件分類： 數(shù)字信號處理
英文描述： 4-BIT, 120 MHz, OTHER DSP, PQFP128
封裝： LQFP-128
文件頁數(shù)： 52/152頁
文件大?。?/td> 2224K
代理商： MC56F8355VFG60
Thermal Design Considerations
56F8355 Technical Data
145
Preliminary
Part 12 Design Considerations
12.1 Thermal Design Considerations
An estimation of the chip junction temperature, TJ, can be obtained from the equation:
TJ = TA + (RθJΑ x PD)
where:
The junction-to-ambient thermal resistance is an industry-standard value that provides a quick and
easy estimation of thermal performance. Unfortunately, there are two values in common usage: the
value determined on a single-layer board and the value obtained on a board with two planes. For
packages such as the PBGA, these values can be different by a factor of two. Which value is closer
to the application depends on the power dissipated by other components on the board. The value
obtained on a single-layer board is appropriate for the tightly packed printed circuit board. The
value obtained on the board with the internal planes is usually appropriate if the board has
low-power dissipation and the components are well separated.
When a heat sink is used, the thermal resistance is expressed as the sum of a junction-to-case
thermal resistance and a case-to-ambient thermal resistance:
RθJΑ = RθJΧ + RθCΑ
where:
RθJC is device-related and cannot be influenced by the user. The user controls the thermal
environment to change the case-to-ambient thermal resistance, RθCA . For instance, the user can
change the size of the heat sink, the air flow around the device, the interface material, the mounting
arrangement on printed circuit board, or change the thermal dissipation on the printed circuit board
surrounding the device.
To determine the junction temperature of the device in the application when heat sinks are not used,
the Thermal Characterization Parameter (
Ψ
JT) can be used to determine the junction temperature
with a measurement of the temperature at the top center of the package case using the following
equation:
TJ = TT + (ΨJT x PD)
where:
TA
= Ambient temperature for the package (oC)
RθJΑ = Junction-to-ambient thermal resistance (
oC/W)
PD
= Power dissipation in the package (W)
RθJA = Package junction-to-ambient thermal resistance °C/W
RθJC = Package junction-to-case thermal resistance °C/W
RθCA = Package case-to-ambient thermal resistance °C/W
TT
= Thermocouple temperature on top of package (oC)
Ψ
JT =
Thermal characterization parameter (oC)/W
PD = Power dissipation in package (W)
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
MC56F8355VFGE 功能描述:數(shù)字信號處理器和控制器 - DSP, DSC 16 BIT HYBRID CNTRLR RoHS:否 制造商:Microchip Technology 核心:dsPIC 數(shù)據(jù)總線寬度:16 bit 程序存儲器大小:16 KB 數(shù)據(jù) RAM 大小:2 KB 最大時(shí)鐘頻率:40 MHz 可編程輸入/輸出端數(shù)量:35 定時(shí)器數(shù)量:3 設(shè)備每秒兆指令數(shù):50 MIPs 工作電源電壓:3.3 V 最大工作溫度:+ 85 C 封裝 / 箱體:TQFP-44 安裝風(fēng)格:SMD/SMT
MC56F8356 制造商:MOTOROLA 制造商全稱:Motorola, Inc 功能描述:56F8356 16-bit Hybrid Controller
MC56F8356MFV60 制造商:Rochester Electronics LLC 功能描述:- Bulk
MC56F8356MFVE 功能描述:數(shù)字信號處理器和控制器 - DSP, DSC 16 BIT HYBRID CONTROLLER RoHS:否 制造商:Microchip Technology 核心:dsPIC 數(shù)據(jù)總線寬度:16 bit 程序存儲器大小:16 KB 數(shù)據(jù) RAM 大小:2 KB 最大時(shí)鐘頻率:40 MHz 可編程輸入/輸出端數(shù)量:35 定時(shí)器數(shù)量:3 設(shè)備每秒兆指令數(shù):50 MIPs 工作電源電壓:3.3 V 最大工作溫度:+ 85 C 封裝 / 箱體:TQFP-44 安裝風(fēng)格:SMD/SMT
MC56F8356VFV60 功能描述:數(shù)字信號處理器和控制器 - DSP, DSC 60MHz 60MIPS RoHS:否 制造商:Microchip Technology 核心:dsPIC 數(shù)據(jù)總線寬度:16 bit 程序存儲器大小:16 KB 數(shù)據(jù) RAM 大小:2 KB 最大時(shí)鐘頻率:40 MHz 可編程輸入/輸出端數(shù)量:35 定時(shí)器數(shù)量:3 設(shè)備每秒兆指令數(shù):50 MIPs 工作電源電壓:3.3 V 最大工作溫度:+ 85 C 封裝 / 箱體:TQFP-44 安裝風(fēng)格:SMD/SMT
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