參數(shù)資料
型號(hào)： MC56F8347MPY60
廠商： FREESCALE SEMICONDUCTOR INC
元件分類： 數(shù)字信號(hào)處理
英文描述： 16-BIT, 120 MHz, OTHER DSP, PQFP160
封裝： LQFP-160
文件頁數(shù)： 38/172頁
文件大?。?/td> 2202K
代理商： MC56F8347MPY60
56F8347 Technical Data, Rev. 5.0
132
Freescale Semiconductor
Preliminary
1. Theta-JA determined on 2s2p test boards is frequently lower than would be observed in an application. Determined on 2s2p ther-
mal test board.
2. Junction to ambient thermal resistance, Theta-JA (RθJA) was simulated to be equivalent to the JEDEC specification JESD51-2
in a horizontal configuration in natural convection. Theta-JA was also simulated on a thermal test board with two internal planes
(2s2p, where “s” is the number of signal layers and “p” is the number of planes) per JESD51-6 and JESD51-7. The correct name
for Theta-JA for forced convection or with the non-single layer boards is Theta-JMA.
3. Junction to case thermal resistance, Theta-JC (RθJC ), was simulated to be equivalent to the measured values using the cold
plate technique with the cold plate temperature used as the "case" temperature. The basic cold plate measurement technique is
described by MIL-STD 883D, Method 1012.1. This is the correct thermal metric to use to calculate thermal performance when
the package is being used with a heat sink.
4. Thermal Characterization Parameter, Psi-JT (
ΨJT ), is the "resistance" from junction to reference point thermocouple on top cen-
ter of case as defined in JESD51-2.
ΨJT is a useful value to use to estimate junction temperature in steady-state customer en-
vironments.
5. Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting site (board) temperature,
ambient temperature, air flow, power dissipation of other components on the board, and board thermal resistance.
6. See Part 12.1 for more details on thermal design considerations.
7. TJ = Junction temperature
TA = Ambient temperature
Table 10-2 56F8347/56F8147 Electrostatic Discharge (ESD) Protection
Characteristic
Min
Typ
Max
Unit
ESD for Human Body Model (HBM)
2000
—
V
ESD for Machine Model (MM)
200
—
V
ESD for Charge Device Model (CDM)
500
—
V
Table 10-3 Thermal Characteristics6
Characteristic
Comments
Symbol
Value
Unit
Notes
160-pin LQFP
Junction to ambient
Natural convection
RθJA
38.5
°C/W
2
Junction to ambient (@1m/sec)
RθJMA
35.4
°C/W
2
Junction to ambient
Natural convection
Four layer board (2s2p)
RθJMA
(2s2p)
33
°C/W
1, 2
Junction to ambient (@1m/sec)
Four layer board (2s2p)
RθJMA
31.5
°C/W
1, 2
Junction to case
RθJC
8.6
°C/W
3
Junction to center of case
ΨJT
0.8
°C/W
4, 5
I/O pin power dissipation
P I/O
User-determined
W
Power dissipation
P D
P D = (IDD x VDD + P I/O)W
Maximum allowed PD
PDMAX
(TJ - TA) / R
θJA7
W
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MC56F8347VPY 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:16-BIT HYBRID CONTROLLERS
MC56F8347VPY60 制造商:Freescale Semiconductor 功能描述:
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MC56F8347VVF 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:16-bit Digital Signal Controllers
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