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| 型號(hào)： | MC56F8014VFAE |
| 廠商： | 飛思卡爾半導(dǎo)體(中國(guó))有限公司 |
| 英文描述： | 16-bit Digital Signal Controllers |
| 中文描述： | 16位數(shù)字信號(hào)控制器 |
| 文件頁數(shù)： | 116/124頁 |
| 文件大?。?/td> | 1878K |
| 代理商： | MC56F8014VFAE |
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56F8014 Technical Data, Rev. 3
116
Preliminary
Part 12 Design Considerations
12.1 Thermal Design Considerations
An estimation of the chip junction temperature, T
J
, can be obtained from the equation:
T
J
= T
A
+ (R
θ
J
Α
x
P
D
)
where:
Ambient temperature for the package (
o
C)
R
θ
J
Α
=
P
D
=
Power dissipation in the package (W)
The junction-to-ambient thermal resistance is an industry-standard value that provides a quick and easy
estimation of thermal performance. Unfortunately, there are two values in common usage: the value
determined on a single-layer board and the value obtained on a board with two planes. For packages such
as the PBGA, these values can be different by a factor of two. Which value is closer to the application
depends on the power dissipated by other components on the board. The value obtained on a single layer
board is appropriate for the tightly packed printed circuit board. The value obtained on the board with the
internal planes is usually appropriate if the board has low-power dissipation and the components are well
separated.
When a heat sink is used, the thermal resistance is expressed as the sum of a junction-to-case thermal
resistance and a case-to-ambient thermal resistance:
R
θ
JA
= R
θ
JC
+ R
θ
CA
where:
R
θ
JC
is device related and cannot be influenced by the user. The user controls the thermal environment to
change the case to ambient thermal resistance, R
θ
CA
. For instance, the user can change the size of the heat
sink, the air flow around the device, the interface material, the mounting arrangement on printed circuit
board, or change the thermal dissipation on the printed circuit board surrounding the device.
To determine the junction temperature of the device in the application when heat sinks are not used, the
Thermal Characterization Parameter (
Ψ
JT
) can be used to determine the junction temperature with a
measurement of the temperature at the top center of the package case using the following equation:
T
J
= T
T
+ (
Ψ
JT
x P
D
)
where:
The thermal characterization parameter is measured per JESD51-2 specification using a 40-gauge type T
thermocouple epoxied to the top center of the package case. The thermocouple should be positioned so
T
A
=
Junction-to-ambient thermal resistance (
o
C/W)
R
θ
JA
R
θ
JC
=
R
θ
CA
=
=
Package junction-to-ambient thermal resistance (°C/W)
Package junction-to-case thermal resistance (°C/W)
Package case-to-ambient thermal resistance (°C/W)
T
T
Ψ
JT
P
D
=
=
=
Thermocouple temperature on top of package (
o
C)
Thermal characterization parameter (
o
C/W)
Power dissipation in package (W)
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