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Contents-11
32192/32195/32196 Group Hardware Manual
Rev.1.10 REJ09B0123-0110 Apr.06.07
CHAPTER 21 JTAG
21.1 Outline of JTAG ----------------------------------------------------------------------------------------------------------- 21-2
21.2 Configuration of JTAG Circuit ------------------------------------------------------------------------------------------ 21-3
21.3 JTAG Registers ----------------------------------------------------------------------------------------------------------- 21-4
21.3.1
Instruction Register (JTAGIR) -------------------------------------------------------------------------------- 21-4
21.3.2
Data Register ---------------------------------------------------------------------------------------------------- 21-5
21.4 Basic Operation of JTAG ----------------------------------------------------------------------------------------------- 21-6
21.4.1
Outline of JTAG Operation ------------------------------------------------------------------------------------ 21-6
21.4.2
IR Path Sequence ---------------------------------------------------------------------------------------------- 21-8
21.4.3
DR Path Sequence --------------------------------------------------------------------------------------------- 21-9
21.4.4
Inspecting and Setting Data Registers --------------------------------------------------------------------- 21-10
21.5 Boundary Scan Description Language ------------------------------------------------------------------------------ 21-11
21.6 Notes on Board Design when Connecting JTAG ------------------------------------------------------------------ 21-12
21.7 Processing Pins when Not Using JTAG ---------------------------------------------------------------------------- 21-13
CHAPTER 22 POWER SUPPLY CIRCUIT
22.1 Configuration of the Power Supply Circuit -------------------------------------------------------------------------- 22-2
22.2 Power-On Sequence ----------------------------------------------------------------------------------------------------- 22-3
22.2.1
Power-On Sequence when Not Using RAM Backup --------------------------------------------------- 22-3
22.2.2
Power-On Sequence when Using RAM Backup --------------------------------------------------------- 22-4
22.3 Power-Off Sequence ----------------------------------------------------------------------------------------------------- 22-5
22.3.1
Power-Off Sequence when Not Using RAM Backup ---------------------------------------------------- 22-5
22.3.2
Power-Off Sequence when Using RAM Backup --------------------------------------------------------- 22-6
CHAPTER 23 ELECTRICAL CHARACTERISTICS
23.1 Adapted Table ------------------------------------------------------------------------------------------------------------- 23-2
23.2 Absolute Maximum Ratings ------------------------------------------------------------------------------------------- 23-2
23.3 Electrical Characteristics when VCCE = 5 V, f(XIN) = 20 MHz ----------------------------------------------- 23-3
23.3.1
Recommended Operating Conditions (when VCCE = 5 V ± 0.5 V, f(XIN) = 20 MHz) ----------- 23-3
23.3.2
D.C. Characteristics (when VCCE = 5 V ± 0.5 V, f(XIN) = 20 MHz) -------------------------------- 23-5
23.3.3
A/D Conversion Characteristics (when VCCE = 5 V ± 0.5 V, f(XIN) = 20 MHz) ------------------ 23-6
23.4 Electrical Characteristics when VCCE = 5 V, f(XIN) = 16 MHz ----------------------------------------------- 23-7
23.4.1
Recommended Operating Conditions (when VCCE = 5 V ± 0.5 V, f(XIN) = 16 MHz) ----------- 23-7
23.4.2
D.C. Characteristics (when VCCE = 5 V ± 0.5 V, f(XIN) = 16 MHz) -------------------------------- 23-9
23.4.3
A/D Conversion Characteristics (when VCCE = 5 V ± 0.5 V, f(XIN) = 16 MHz) ------------------ 23-10
23.5 Electrical Characteristics when VCCE = 3.3 V, f(XIN) = 20 MHz --------------------------------------------- 23-11
23.5.1
Recommended Operating Conditions (when VCCE = 3.3 V ± 0.3 V, f(XIN) = 20 MHz) -------- 23-11
23.5.2
D.C. Characteristics (when VCCE = 3.3 V ± 0.3 V, f(XIN) = 20 MHz) ------------------------------ 23-13
23.5.3
A/D Conversion Characteristics (when VCCE = 3.3 V ± 0.3 V, f(XIN) = 20 MHz) --------------- 23-14
23.6 Electrical Characteristics when VCCE = 3.3 V, f(XIN) = 16 MHz --------------------------------------------- 23-15
23.6.1
Recommended Operating Conditions (when VCCE = 3.3 V ± 0.3 V f(XIN) = 16 MHz) --------- 23-15
23.6.2
D.C. Characteristics (when VCCE = 3.3 V ± 0.3 V, f(XIN) = 16 MHz) ------------------------------ 23-17
23.6.3
A/D Conversion Characteristics (when VCCE = 3.3 V ± 0.3 V, f(XIN) = 8 MHz) ----------------- 23-18
23.7 Flash Memory Related Characteristics ----------------------------------------------------------------------------- 23-19
23.8 External Capacitance for Power Supply ---------------------------------------------------------------------------- 23-19
23.9 A.C. Characteristics (when VCCE = 5 V) -------------------------------------------------------------------------- 23-20
23.10 A.C. Characteristics (when VCCE = 3.3 V) ---------------------------------------------------------------------- 23-42